ABOUT US

About Microgroups


Shenzhen Micro Group Semiconductor Technology Co., Ltd. was established in 2017 and is a holding subsidiary of listed companies. Focusing on the research and development of fully automatic micron-level high-precision micro-assembly equipment, it is a professional manufacturer of semiconductor micro-assembly equipment integrating design, production, sales and service. Product application areas: sensor assembly, optical device optical module assembly, hybrid integrated circuit assembly, microwave device assembly, medical/security detector imaging module assembly, Mini LED mounting and repair, etc. The company has always adhered to the concept of independent research and development and quality first, and has obtained more than 60 invention patents, practical patents and software copyrights. Through the ISO9001 quality management system certification, it has won the title of China's outstanding innovation and entrepreneurship enterprise.

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Product Center

MicroASM AMS invert bonding machine

AM-S platform is an off-line automatic micro assembly system developed by the company, which can be equipped with nozzle heating module, material tray/wafer placing plate, ultrasonic module, laser heating module, UV dispensing and curing module, hot nitrogen and formic acid process protection gas module, base preheating module, process monitoring module, chip flip welding module.

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MicroASM M-10S micro-assembly bonding machine

The M-s platform is a manual - semi-automatic micro-assembly system. Based on this platform, three models of M5S/M10S/M20S with different positioning accuracy were developed. Equipped with nozzle heating module, laser heating module, UV dispensing and curing module, hot nitrogen protection gas module, base preheating module, process monitoring module, chip flip welding module.

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AM series Mini LED full-automatic laser repair equipment

Micro ASM AM series Mini LED full-automatic laser repair equipment AM-X platform is a complete micro-assembly system. Its core module integrates three parts: high-precision mount system, prefix system and production data analysis. The double drive structure of micron gantry can be used to construct the online generating system.

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MicroASM AMX full-function Die-Bonder

AM-X platform is a complete micro assembly system. Its core module integrates three parts: high-precision mount system, prefix system and production data analysis. The double drive structure of micron gantry can be conveniently composed and generated online.   It can be equipped with nozzle heating module, material plate/wafer placing plate, ultrasonic module, laser heating module, UV dispensing and curing module, hot nitrogen and formic acid process protection gas module, base preheating module, process monitoring module, chip flip welding module.

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MicroASM AMS invert bonding machine

AM-S platform is an off-line automatic micro assembly system developed by the company, which can be equipped with nozzle heating module, material tray/wafer placing plate, ultrasonic module, laser heating module, UV dispensing and curing module, hot nitrogen and formic acid process protection gas module, base preheating module, process monitoring module, chip flip welding module.

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ShuttleStar RW - SV560A

SV560A adopts streamlined appearance design, saving space, with automatic material absorption, automatic welding, automatic disassembly, automatic material discharge. It equipped with up and down hot air, bottom infrared, three temperature zone independent heating, heating time and temperature real-time display. The bottom of the machine is equipped with the strong cross-flow fan cooling, which can cool quickly and reliably; It has the functions of light splitting, amplification and fine adjustment, including color difference distinguishing device, automatic focus and software operation. It equipped embedded industrial control computer,

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