imgimgimg

这是描述信息
Case
Your present location:
Homepage
/
/
Adhesive technology

Adhesive technology

  • Categories:Applications
  • Author:
  • Origin:
  • Time of issue:2020-01-03
  • Views:0

(Summary description)Adhesivetechnology  Glueinsemiconductorpackagingplaysanindispensablerolelikeconcreteintheconstructionofhigh-risebuildings,suchaschipfixation(redgluefixationchip),electricalconnection(silverpastefixationsemiconductorchip),stressreduction(silicagelfixationMEMSdevice),deviceprotection(COBencapsulationchip)andsoon.Glueplaysanimportantroleinpackaging,andtherearemanywaysofdispensing,commondispensingmethodsincludethefollowingfour:Whatarethechallenges?DispensingmodeadvantagesdisadvantagesnoteTime-pressureneedledispensingSimplestructure,lowmaintenancecostLowaccuracy,affectedbyliquidlevel、ScrewvalveHighaccuracy,suitableforhighviscosityandpackingliquid Screwcleaningisnotconvenient,thefluidisgreatlyaffectedbytheambienttemperatureSuitableforsolvent;Solderpaste,particulatematerial;Hotmeltgrease;Silverpasteetc.PistonpumpNotaffectedbyfluidviscositychanges Cleaningisdifficult,notsuitableforpackingfluidSuitablefordot,notformarking SprayDispensingHighspeed,highprecision,nocontact,nodamagedevice,nozaxismotionHighcost,difficultcleaning,notsuitableforlargeparticlepackingfluidDrivethefiringneedletomoveathighspeedthroughhighspeedsolenoidvalve,andsprayafixednumberofgluepointsinunittimesolution typeofglueapplicationDispensingmode Quick-dryingglueMobilephonebutton,circuittemporarybondingNeedle,rubbervalveUvglueTouchscreen,LCDcircuit protection,buttons,headset,CCD,CCMlensSpray,time-pressurerubbervalveBottomFillCOBSMT,BGASpray,screwvalve,needlebarrelConductiveadhesive,solderpaste SMT,LCD,LEDScrewvalve,needlebarrelThreeproofingglueFlexibleplate,waterproofcaseThesprayvalveTwocomponentacrylicacid,twocomponentepoxyHousingbond,seal,connectorbondTwocomponentrubbervalve

Adhesive technology

(Summary description)Adhesivetechnology  Glueinsemiconductorpackagingplaysanindispensablerolelikeconcreteintheconstructionofhigh-risebuildings,suchaschipfixation(redgluefixationchip),electricalconnection(silverpastefixationsemiconductorchip),stressreduction(silicagelfixationMEMSdevice),deviceprotection(COBencapsulationchip)andsoon.Glueplaysanimportantroleinpackaging,andtherearemanywaysofdispensing,commondispensingmethodsincludethefollowingfour:Whatarethechallenges?DispensingmodeadvantagesdisadvantagesnoteTime-pressureneedledispensingSimplestructure,lowmaintenancecostLowaccuracy,affectedbyliquidlevel、ScrewvalveHighaccuracy,suitableforhighviscosityandpackingliquid Screwcleaningisnotconvenient,thefluidisgreatlyaffectedbytheambienttemperatureSuitableforsolvent;Solderpaste,particulatematerial;Hotmeltgrease;Silverpasteetc.PistonpumpNotaffectedbyfluidviscositychanges Cleaningisdifficult,notsuitableforpackingfluidSuitablefordot,notformarking SprayDispensingHighspeed,highprecision,nocontact,nodamagedevice,nozaxismotionHighcost,difficultcleaning,notsuitableforlargeparticlepackingfluidDrivethefiringneedletomoveathighspeedthroughhighspeedsolenoidvalve,andsprayafixednumberofgluepointsinunittimesolution typeofglueapplicationDispensingmode Quick-dryingglueMobilephonebutton,circuittemporarybondingNeedle,rubbervalveUvglueTouchscreen,LCDcircuit protection,buttons,headset,CCD,CCMlensSpray,time-pressurerubbervalveBottomFillCOBSMT,BGASpray,screwvalve,needlebarrelConductiveadhesive,solderpaste SMT,LCD,LEDScrewvalve,needlebarrelThreeproofingglueFlexibleplate,waterproofcaseThesprayvalveTwocomponentacrylicacid,twocomponentepoxyHousingbond,seal,connectorbondTwocomponentrubbervalve

  • Categories:Applications
  • Author:
  • Origin:
  • Time of issue:2020-01-03
  • Views:0
Information

  Adhesive technology


  Glue in semiconductor packaging plays an indispensable role like concrete in the construction of high-rise buildings, such as chip fixation (red glue fixation chip), electrical connection (silver paste fixation semiconductor chip), stress reduction (silica gel fixation MEMS device), device protection (COB encapsulation chip) and so on. Glue plays an important role in packaging, and there are many ways of dispensing, common dispensing methods include the following four:

What are the challenges?

Dispensing mode

advantages

disadvantages

note

Time -pressure needle dispensing

Simple structure, low maintenance cost

Low accuracy, affected by liquid level

Screw valve

High accuracy, suitable for high viscosity and packing liquid

 

Screw cleaning is not convenient, the fluid is greatly affected by the ambient temperature

Suitable for solvent;Solder paste, particulate material;Hot melt grease;Silver paste etc.

Piston pump

Not affected by fluid viscosity changes

 

Cleaning is difficult, not suitable for packing fluid

Suitable for dot, not for marking

 

Spray Dispensing

High speed, high precision , no contact, no damage device, no z axis motion

High cost, difficult cleaning, not suitable for large particle packing fluid

Drive the firing needle to move at high speed through high speed solenoid valve, and spray a fixed number of glue points in unit time

1

solution


 

type of glue

application

Dispensing mode

 

Quick-drying glue

Mobile phone button, circuit temporary bonding

Needle, rubber valve

Uv glue

Touch screen, LCD circuit  protection, buttons, headset, CCD, CCM lens

Spray, time - pressure rubber valve

Bottom Fill COB

SMT,BGA

Spray, screw valve, needle barrel

Conductive adhesive, solder paste

 

SMT,LCD,LED

Screw valve, needle barrel

Three proofing glue

Flexible plate, waterproof case

The spray valve

Two component acrylic acid, two component epoxy

Housing bond, seal, connector bond

Two component rubber valve

 

Scan the QR code to read on your phone

Contact

URL:http://www.microasm.com

Company email:sales@microasm.com
Office  Headquarters: 401, Building 6, Country Garden Plant, No. 2 Eighth Road, Yangyong Industrial Zone, Shapu Community, Songgang Street, Bao'an District, Shenzhen

Office: Yangyong Industrial Zone, Shapu Community, Songgang Street, Baoan District, Shenzhen

搜索
确认
取消
img

Website QR code

 Copyright  © 2020 Shenzhen MicroASM Seminconductor Technology Co.,Ltd  All rights reserved      粤ICP备18019383号       300.cn

Contact