Adhesive technology

Categories:Applications
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Time of issue:2020-01-03
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(Summary description)Adhesivetechnology　　Glueinsemiconductorpackagingplaysanindispensablerolelikeconcreteintheconstructionofhigh-risebuildings,suchaschipfixation(redgluefixationchip),electricalconnection(silverpastefixationsemiconductorchip),stressreduction(silicagelfixationMEMSdevice),deviceprotection(COBencapsulationchip)andsoon.Glueplaysanimportantroleinpackaging,andtherearemanywaysofdispensing,commondispensingmethodsincludethefollowingfour:Whatarethechallenges?DispensingmodeadvantagesdisadvantagesnoteTime-pressureneedledispensingSimplestructure,lowmaintenancecostLowaccuracy,affectedbyliquidlevel、ScrewvalveHighaccuracy,suitableforhighviscosityandpackingliquid Screwcleaningisnotconvenient,thefluidisgreatlyaffectedbytheambienttemperatureSuitableforsolvent;Solderpaste,particulatematerial;Hotmeltgrease;Silverpasteetc.PistonpumpNotaffectedbyfluidviscositychanges Cleaningisdifficult,notsuitableforpackingfluidSuitablefordot,notformarking SprayDispensingHighspeed,highprecision,nocontact,nodamagedevice,nozaxismotionHighcost,difficultcleaning,notsuitableforlargeparticlepackingfluidDrivethefiringneedletomoveathighspeedthroughhighspeedsolenoidvalve,andsprayafixednumberofgluepointsinunittimesolution typeofglueapplicationDispensingmode Quick-dryingglueMobilephonebutton,circuittemporarybondingNeedle,rubbervalveUvglueTouchscreen,LCDcircuit protection,buttons,headset,CCD,CCMlensSpray,time-pressurerubbervalveBottomFillCOBSMT,BGASpray,screwvalve,needlebarrelConductiveadhesive,solderpaste SMT,LCD,LEDScrewvalve,needlebarrelThreeproofingglueFlexibleplate,waterproofcaseThesprayvalveTwocomponentacrylicacid,twocomponentepoxyHousingbond,seal,connectorbondTwocomponentrubbervalve

Adhesive technology

(Summary description)Adhesivetechnology　　Glueinsemiconductorpackagingplaysanindispensablerolelikeconcreteintheconstructionofhigh-risebuildings,suchaschipfixation(redgluefixationchip),electricalconnection(silverpastefixationsemiconductorchip),stressreduction(silicagelfixationMEMSdevice),deviceprotection(COBencapsulationchip)andsoon.Glueplaysanimportantroleinpackaging,andtherearemanywaysofdispensing,commondispensingmethodsincludethefollowingfour:Whatarethechallenges?DispensingmodeadvantagesdisadvantagesnoteTime-pressureneedledispensingSimplestructure,lowmaintenancecostLowaccuracy,affectedbyliquidlevel、ScrewvalveHighaccuracy,suitableforhighviscosityandpackingliquid Screwcleaningisnotconvenient,thefluidisgreatlyaffectedbytheambienttemperatureSuitableforsolvent;Solderpaste,particulatematerial;Hotmeltgrease;Silverpasteetc.PistonpumpNotaffectedbyfluidviscositychanges Cleaningisdifficult,notsuitableforpackingfluidSuitablefordot,notformarking SprayDispensingHighspeed,highprecision,nocontact,nodamagedevice,nozaxismotionHighcost,difficultcleaning,notsuitableforlargeparticlepackingfluidDrivethefiringneedletomoveathighspeedthroughhighspeedsolenoidvalve,andsprayafixednumberofgluepointsinunittimesolution typeofglueapplicationDispensingmode Quick-dryingglueMobilephonebutton,circuittemporarybondingNeedle,rubbervalveUvglueTouchscreen,LCDcircuit protection,buttons,headset,CCD,CCMlensSpray,time-pressurerubbervalveBottomFillCOBSMT,BGASpray,screwvalve,needlebarrelConductiveadhesive,solderpaste SMT,LCD,LEDScrewvalve,needlebarrelThreeproofingglueFlexibleplate,waterproofcaseThesprayvalveTwocomponentacrylicacid,twocomponentepoxyHousingbond,seal,connectorbondTwocomponentrubbervalve

Categories:Applications
Author:
Origin:
Time of issue:2020-01-03
Views:0

　　Adhesive technology

　　Glue in semiconductor packaging plays an indispensable role like concrete in the construction of high-rise buildings, such as chip fixation (red glue fixation chip), electrical connection (silver paste fixation semiconductor chip), stress reduction (silica gel fixation MEMS device), device protection (COB encapsulation chip) and so on. Glue plays an important role in packaging, and there are many ways of dispensing, common dispensing methods include the following four:

What are the challenges?

Dispensing mode	advantages	disadvantages	note
Time -pressure needle dispensing	Simple structure, low maintenance cost	Low accuracy, affected by liquid level	、
Screw valve	High accuracy, suitable for high viscosity and packing liquid	Screw cleaning is not convenient, the fluid is greatly affected by the ambient temperature	Suitable for solvent;Solder paste, particulate material;Hot melt grease;Silver paste etc.
Piston pump	Not affected by fluid viscosity changes	Cleaning is difficult, not suitable for packing fluid	Suitable for dot, not for marking
Spray Dispensing	High speed, high precision , no contact, no damage device, no z axis motion	High cost, difficult cleaning, not suitable for large particle packing fluid	Drive the firing needle to move at high speed through high speed solenoid valve, and spray a fixed number of glue points in unit time

solution

type of glue	application	Dispensing mode
Quick-drying glue	Mobile phone button, circuit temporary bonding	Needle, rubber valve
Uv glue	Touch screen, LCD circuit protection, buttons, headset, CCD, CCM lens	Spray, time - pressure rubber valve
Bottom Fill COB	SMT,BGA	Spray, screw valve, needle barrel
Conductive adhesive, solder paste	SMT,LCD,LED	Screw valve, needle barrel
Three proofing glue	Flexible plate, waterproof case	The spray valve
Two component acrylic acid, two component epoxy	Housing bond, seal, connector bond	Two component rubber valve

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