MEMS Micro-Assembly
- Categories:Applications
- Author:
- Origin:
- Time of issue:2020-01-03
- Views:0
(Summary description)MEMSMicro-Assembly (Micro-electromechanicalsystems,MEMSmicro/mechanical/microsystem)MEMSsensoristhemainadvantageissmallvolume,lightweight,lowpowerconsumption,highreliability,highsensitivity,easyintegrationandsoon,isthemainforceofthemicrosensor,isgraduallyreplacingthetraditionalmechanicalsensors,inalmosteveryfieldresearch,whetheritisconsumerelectronics,automotive,andaerospace,machinery,chemicalindustryandmedicinefields. Whatarethechallenges? ThesolutionPickuptoolsandfunctionmodules Customizedspecialpickupsuctionheadwithautomaticpressuremoduletoensurethesafetyofcontrollablebondingpressureandcomponents Customizedspecialsuctionheadcanactivelyandpassivelyself-levelingtoensuretheflatnessofbondinginterfaceandpreventSMILEeffect.Itcanbeequippedwithnozzleheatingmodule,ultrasonicmodule,laserheatingmodule,UVdispensingandcuringmodule,hotnitrogenandformicacidprocessprotectiongas,basepreheatingmodule,processcontrolmodule,chipflipweldingmodule .Itcanbeabletoachievehighprecisionautomaticalignment,mounting,dispensing,bondingandothercorefunctions.Differentfunctionalmodulescanbecustomizedtocompleteultrasonichotpressingbonding,laserhotpressingbonding(tin,indium,eutectic)adhesive,curingandothertechnologies.
MEMS Micro-Assembly
(Summary description)MEMSMicro-Assembly (Micro-electromechanicalsystems,MEMSmicro/mechanical/microsystem)MEMSsensoristhemainadvantageissmallvolume,lightweight,lowpowerconsumption,highreliability,highsensitivity,easyintegrationandsoon,isthemainforceofthemicrosensor,isgraduallyreplacingthetraditionalmechanicalsensors,inalmosteveryfieldresearch,whetheritisconsumerelectronics,automotive,andaerospace,machinery,chemicalindustryandmedicinefields. Whatarethechallenges? ThesolutionPickuptoolsandfunctionmodules Customizedspecialpickupsuctionheadwithautomaticpressuremoduletoensurethesafetyofcontrollablebondingpressureandcomponents Customizedspecialsuctionheadcanactivelyandpassivelyself-levelingtoensuretheflatnessofbondinginterfaceandpreventSMILEeffect.Itcanbeequippedwithnozzleheatingmodule,ultrasonicmodule,laserheatingmodule,UVdispensingandcuringmodule,hotnitrogenandformicacidprocessprotectiongas,basepreheatingmodule,processcontrolmodule,chipflipweldingmodule .Itcanbeabletoachievehighprecisionautomaticalignment,mounting,dispensing,bondingandothercorefunctions.Differentfunctionalmodulescanbecustomizedtocompleteultrasonichotpressingbonding,laserhotpressingbonding(tin,indium,eutectic)adhesive,curingandothertechnologies.
- Categories:Applications
- Author:
- Origin:
- Time of issue:2020-01-03
- Views:0
MEMS Micro-Assembly
(Micro-electromechanical systems, MEMS micro/mechanical/micro system) MEMS sensor is the main advantage is small volume, light weight, low power consumption, high reliability, high sensitivity, easy integration and so on, is the main force of the micro sensor, is gradually replacing the traditional mechanical sensors, in almost every field research, whether it is consumer electronics, automotive, and aerospace, machinery, chemical industry and medicine fields.
The solution
Pick up tools and function modules
Customized special pickup suction head with automatic pressure module to ensure the safety of controllable bonding pressure and components
Customized special suction head can actively and passively self-leveling to ensure the flatness of bonding interface and prevent SMILE effect.
It can be equipped with nozzle heating module, ultrasonic module, laser heating module, UV dispensing and curing module, hot nitrogen and formic acid process protection gas, base preheating module, process control module, chip flip welding module .
It can be able to achieve high precision automatic alignment, mounting, dispensing, bonding and other core functions. Different functional modules can be customized to complete ultrasonic hot pressing bonding, laser hot pressing bonding (tin, indium, eutectic) adhesive, curing and other technologies.
Scan the QR code to read on your phone
Products
MicroASM AMX full-function sticky machine
MicroASM AMS Flip Bonder
Micro group MicroASM M micro assembly bonding machine
MicroASM M-10S Micro Assembly Bonding Machine
AM series Mini LED full-automatic laser repair equipment
Effective ShuttleStar SV-2000A
Effective ShuttleStar RW-E6250U
Effective ShuttleStar RW-SV560A
Effective ShuttleStar RW-SV550
Contact
Company email：sales@microasm.com
Office Headquarters: 401, Building 6, Country Garden Plant, No. 2 Eighth Road, Yangyong Industrial Zone, Shapu Community, Songgang Street, Bao'an District, Shenzhen
Office: Yangyong Industrial Zone, Shapu Community, Songgang Street, Baoan District, Shenzhen
Website QR code
Copyright © 2020 Shenzhen MicroASM Seminconductor Technology Co.,Ltd All rights reserved 粤ICP备18019383号 300.cn
