The World's Largest Semiconductor Professional Technology Exhibition-SEMICON China
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- Time of issue:2019-10-01
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(Summary description)AboutUs ShenzhenMicroASMSemiconductorTechnologyCo.,Ltd.focusesontheR&D,design,assemblyandsalesofhigh-performancestickyequipment,andfocusesonthedevelopmentofhigh-speed,high-precision,multi-functional,fullyautomaticsemiconductorpackagingequipment.ThemainfieldsinvolvedareICintegratedcircuitpackaging,MLED/MiniLEDpackaging,high-speedopticalmoduleassembly,RFdevice,microwavedevice,MEMSsensorandotherdevicepackaging,andmedicalCTdetectorassembly.High-precisionmotioncontroltechnology,leadingmachinevisiontechnologyandflexiblesoftwarealgorithmsareourcorecompetitiveness.Weareproficientinrichsemiconductorpackagingtechnology,andtheequipmentcanassemblevariousprocessmodules,suchashigh-precisiondispensingmodules,UVlightcuringmodules,eutecticbondingmodules,laserheatingmodules,ultrasonicheatingmodules,frictionweldingmodules,Laserrangingmodule,hotnitrogenprotectionmodule,real-timemonitoringmodule,automaticnozzleswitchingfunctionmodule,Wafer&Trayfeedingmodule,etc.Theequipmentsystemcaninterfacewiththeworkshopmanagementsystem,recordtheplacementprocessofeachdeviceinrealtime,andcanchecktheproductionstatusoftheequipmentatanytime.Atthesametime,theplacementcompensationparameterscanbeadjustedaccordingtothedynamicdatatooptimizetheequipmentuse.Wearecommittedtoprovidingcustomerswithaseriesofsemiconductordevicepackagingsolutions,providingcustomerswithbetterproductsandservicesandcontinuouslycreatingnewvalue.Sofar,wehaveestablishedstrategicpartnershipswithindustryleaderssuchasGeneralMedical,InstituteofMicroelectronics,ChineseAcademyofSciences,SecondAcademyofAerospaceScienceandTechnology,ThirdAcademy,BOE,ShennanCircuit,TsinghuaUniversity,SouthernUniversityofScienceandTechnology,NationalUniversityofDefenseTechnology,etc.Relationship,wehaveastrongafter-salesteamthatcanprovidecustomerswithfasterandbetterservicesatanytime. Ourcompanysellsthefollowingself-developedcutting-edgeprocessequipment: MicroASMMicroASMAMSFlipBonder Applicationareas:MEMSpackaging,flip-chipbonding,front-chipbonding WaferlevelpackageOpticalmodulepackageSensorpackageMiniLEDplacement MicroASMAMXfull-functionstickymachine Applicationareas:MicroLED,miniLEDarraychippatch, Microopticalchip,displaychippackage ·Metric03015,008004devicesonnextgenerationmobilephones ·LargeMedicalEquipment(CoreImagingModuleAssembly) ·Opticaldevices(laserLDpalladiumassembly,VCSEL,PD,LENSassembly,etc.) ·Semiconductors(MEMSdevices,RFdevices,microwavedevicesandhybridcircuits) ·Siliconchip,GaAschip,bulksilicondevice,AlGaInN,etc. MicroASMM-Smanual-semi-automaticmicro-assemblysystem TheM-Splatformisamanual-semi-automaticmicro-assemblysystem.Canbematchedwithnozzleheatingmodule,laserheatingmodule,UVdispensingandcuringmodule,hotnitrogenprotectivegasmodule,substratepreheatingmodule,processmonitoringmodule,andflipchipsolderingmodule. Thisseriesofproductshasstableperformance,highcostperformance,andeasyoperation.Itisespeciallysuitableforscientificresearchinstitutesanduniversitylaboratoriesthatdonotrequirehighproductionefficiencyandhighaccuracyrequirements. Applications:MEMSpackaging,flip-chipbonding,front-chipbonding WaferlevelpackageOpticalmodulepackageSensorpackageMiniLEDplacement
The World's Largest Semiconductor Professional Technology Exhibition-SEMICON China
(Summary description)AboutUs ShenzhenMicroASMSemiconductorTechnologyCo.,Ltd.focusesontheR&D,design,assemblyandsalesofhigh-performancestickyequipment,andfocusesonthedevelopmentofhigh-speed,high-precision,multi-functional,fullyautomaticsemiconductorpackagingequipment.ThemainfieldsinvolvedareICintegratedcircuitpackaging,MLED/MiniLEDpackaging,high-speedopticalmoduleassembly,RFdevice,microwavedevice,MEMSsensorandotherdevicepackaging,andmedicalCTdetectorassembly.High-precisionmotioncontroltechnology,leadingmachinevisiontechnologyandflexiblesoftwarealgorithmsareourcorecompetitiveness.Weareproficientinrichsemiconductorpackagingtechnology,andtheequipmentcanassemblevariousprocessmodules,suchashigh-precisiondispensingmodules,UVlightcuringmodules,eutecticbondingmodules,laserheatingmodules,ultrasonicheatingmodules,frictionweldingmodules,Laserrangingmodule,hotnitrogenprotectionmodule,real-timemonitoringmodule,automaticnozzleswitchingfunctionmodule,Wafer&Trayfeedingmodule,etc.Theequipmentsystemcaninterfacewiththeworkshopmanagementsystem,recordtheplacementprocessofeachdeviceinrealtime,andcanchecktheproductionstatusoftheequipmentatanytime.Atthesametime,theplacementcompensationparameterscanbeadjustedaccordingtothedynamicdatatooptimizetheequipmentuse.Wearecommittedtoprovidingcustomerswithaseriesofsemiconductordevicepackagingsolutions,providingcustomerswithbetterproductsandservicesandcontinuouslycreatingnewvalue.Sofar,wehaveestablishedstrategicpartnershipswithindustryleaderssuchasGeneralMedical,InstituteofMicroelectronics,ChineseAcademyofSciences,SecondAcademyofAerospaceScienceandTechnology,ThirdAcademy,BOE,ShennanCircuit,TsinghuaUniversity,SouthernUniversityofScienceandTechnology,NationalUniversityofDefenseTechnology,etc.Relationship,wehaveastrongafter-salesteamthatcanprovidecustomerswithfasterandbetterservicesatanytime. Ourcompanysellsthefollowingself-developedcutting-edgeprocessequipment: MicroASMMicroASMAMSFlipBonder Applicationareas:MEMSpackaging,flip-chipbonding,front-chipbonding WaferlevelpackageOpticalmodulepackageSensorpackageMiniLEDplacement MicroASMAMXfull-functionstickymachine Applicationareas:MicroLED,miniLEDarraychippatch, Microopticalchip,displaychippackage ·Metric03015,008004devicesonnextgenerationmobilephones ·LargeMedicalEquipment(CoreImagingModuleAssembly) ·Opticaldevices(laserLDpalladiumassembly,VCSEL,PD,LENSassembly,etc.) ·Semiconductors(MEMSdevices,RFdevices,microwavedevicesandhybridcircuits) ·Siliconchip,GaAschip,bulksilicondevice,AlGaInN,etc. MicroASMM-Smanual-semi-automaticmicro-assemblysystem TheM-Splatformisamanual-semi-automaticmicro-assemblysystem.Canbematchedwithnozzleheatingmodule,laserheatingmodule,UVdispensingandcuringmodule,hotnitrogenprotectivegasmodule,substratepreheatingmodule,processmonitoringmodule,andflipchipsolderingmodule. Thisseriesofproductshasstableperformance,highcostperformance,andeasyoperation.Itisespeciallysuitableforscientificresearchinstitutesanduniversitylaboratoriesthatdonotrequirehighproductionefficiencyandhighaccuracyrequirements. Applications:MEMSpackaging,flip-chipbonding,front-chipbonding WaferlevelpackageOpticalmodulepackageSensorpackageMiniLEDplacement
- Categories:News Center
- Author:
- Origin:
- Time of issue:2019-10-01
- Views:0
About Us
Shenzhen MicroASM Semiconductor Technology Co., Ltd. focuses on the R & D, design, assembly and sales of high-performance sticky equipment, and focuses on the development of high-speed, high-precision, multi-functional, fully automatic semiconductor packaging equipment. The main fields involved are IC integrated circuit packaging, M LED / Mini LED packaging, high-speed optical module assembly, RF device, microwave device, MEMS sensor and other device packaging, and medical CT detector assembly. High-precision motion control technology, leading machine vision technology and flexible software algorithms are our core competitiveness. We are proficient in rich semiconductor packaging technology, and the equipment can assemble various process modules, such as high-precision dispensing modules, UV light curing modules, eutectic bonding modules, laser heating modules, ultrasonic heating modules, friction welding modules, Laser ranging module, hot nitrogen protection module, real-time monitoring module, automatic nozzle switching function module, Wafer & Tray feeding module, etc. The equipment system can interface with the workshop management system, record the placement process of each device in real time, and can check the production status of the equipment at any time. At the same time, the placement compensation parameters can be adjusted according to the dynamic data to optimize the equipment use. We are committed to providing customers with a series of semiconductor device packaging solutions, providing customers with better products and services and continuously creating new value. So far, we have established strategic partnerships with industry leaders such as General Medical, Institute of Microelectronics, Chinese Academy of Sciences, Second Academy of Aerospace Science and Technology, Third Academy, BOE, Shennan Circuit, Tsinghua University, Southern University of Science and Technology, National University of Defense Technology, etc. Relationship, we have a strong after-sales team that can provide customers with faster and better services at any time.
Our company sells the following self-developed cutting-edge process equipment:
MicroASM MicroASM AMS Flip Bonder
Application areas: MEMS packaging, flip-chip bonding, front-chip bonding
MicroASM AMX full-function sticky machine
Application areas: Micro LED, miniLED array chip patch,
MicroASM M-S manual-semi-automatic micro-assembly system
The M-S platform is a manual-semi-automatic micro-assembly system. Can be matched with nozzle heating module, laser heating module, UV dispensing and curing module, hot nitrogen protective gas module, substrate preheating module, process monitoring module, and flip chip soldering module.
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Products
MicroASM AMX full-function sticky machine
MicroASM AMS Flip Bonder
Micro group MicroASM M micro assembly bonding machine
MicroASM M-10S Micro Assembly Bonding Machine
AM series Mini LED full-automatic laser repair equipment
Effective ShuttleStar SV-2000A
Effective ShuttleStar RW-E6250U
Effective ShuttleStar RW-SV560A
Effective ShuttleStar RW-SV550
Contact
Company email：sales@microasm.com
Office Headquarters: 401, Building 6, Country Garden Plant, No. 2 Eighth Road, Yangyong Industrial Zone, Shapu Community, Songgang Street, Bao'an District, Shenzhen
Office: Yangyong Industrial Zone, Shapu Community, Songgang Street, Baoan District, Shenzhen
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