MicroASM Semiconductor Will Bring Micro Assembly System Equipment To Participate In CIOE 2019
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- Time of issue:2019-11-01
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(Summary description)GatheringinnovationpowerandintegratingtheentirephotovoltaicindustrychainThe21stChinaInternationalOptoelectronicExposition(CIOE)Willbe September4-7,2019atShenzhenConventionandExhibitionCenter Hold。 ShenzhenMicroASMSemiconductorTechnologyCo.,Ltd.willbringonlinefull-automaticbondingmachineAM-X,offlinefull-automaticsemiconductorstickingmachineAM-S,offlinesemi-automaticmicro-assemblybondingmachineM-5,offlinemanualmicro-assemblyThesystemM-10Sseriesequipmentisgrandlyexhibitedintheexhibitionarea:LaserTechnologyandIntelligentManufacturingExhibitionHall22Q112Q12,sincerelyinvitecolleaguesintheindustrytovisit,exchangeandbusinessnegotiations. Exhibits —————— Boothnumber2Q112Q12 Onlineautomaticmicro-groupsystem TheAM-Xplatformisacompletemicro-assemblysystem.Itscoremoduleintegratesthreeparts:high-precisionplacementsystem,pre-fixationsystemandproductiondataanalysis.Themicro-levelgantrydoubledrivestructurecanbeusedtoformanonlinegenerationsystem. Canbeequippedwithnozzleheatingmodule,tray/waferplacingtray,ultrasonicmodule,laserheatingmodule,UVdispensingandcuringmodule,hotnitrogenandformicacidprocessprotectivegasmodule,basiclow-heatingmodule,processmonitoringmodule,chippourInstalltheweldingmodule. Electronicdevices(MicroLED,miniLEDdisplaychips,metric03015,008004devicesonnext-generationmobilephones),largemedicaldevices(coreimagingmoduleassembly),opticaldevices(laserLDpalladiumassembly,VCSEL,PD,LENS,etc.),Semiconductors(MEMSdevices,RFdevices,microwavedevicesandhybridcircuits)andotherfieldsarewidelyused. TheAM-Xsystemwillrecordtheplacementdataofeachproductinrealtime,andcanfreelyandflexiblyquerytheproductionstatus,andatthesametimeadjusttheplacementcompensationdataaccordingtothedynamicdatatoachievethebestproductionstatus. Applicationareas: MicroLED,miniLEDarraychippatch Microopticalchip,displaychippackage 的Metric03015,008004devicesonnext-generationphones Largemedicalequipment(coreimagingmoduleassembly) Kryptonoptics(laserLDpalladiumassembly,VCSEL,PD,LENSassembly,etc.) Semiconductors(MEMSdevices,RFdevices,microwavedevicesandhybridcircuits) Siliconchip,GaAschip,bulksilicondevice,AlGaInN,etc. Offlinefull-automaticmicro-groupsystem TheAM-Splatformisanofflinefullyautomaticmicro-assemblysystemdevelopedbythecompany,whichcanbeequippedwithanozzleheatingmodule,atray/waferplacingtray,anultrasonicmodule,alaserheatingmodule,aUVdispensingandcuringmodule,hotnitrogenandformicacidprocessesProtectivegasmodule,substratepreheatingmodule,processmonitoringmodule,chipflip-chipsolderingmodule. Theplatformadoptsamarblebridgestructure,anditscoremotion-relatedcomponentsadopttheIsraelimilitarybrandELMOdrivesystemandtheDutchtoplineardrivemotorTECNOTION,whichcanachieve0.1μresolutionand0.5μrepetitivepositioningaccuracyonasingleaxis. Thesoftwaresystemdevelopedbythecompanyintegratesfunctionalmodulessuchasinternalconstanttemperaturecontrol,placementaccuracyself-tuning,andplacementdataanalysis.Wecancustomizetheprocessflow,software,andmodulesfordifferentcustomerneeds,maximizingthein-depthcombinationofequipmentapplicationsandcustomeractualprocess. Applicationarea： MEMSpackaging Flip-chipbonding Chipbonding Waferlevelpackaging Opticalmodulepackage Sensorpackage MiniLEDMount Off-linesemi-automaticmicro-groupsystem TheMplatformisanofflinesemi-automaticmicro-assemblysystem.Basedonthisplatform,threemodelswithdifferentpositioningaccuracyofM5/M10/M20havebeendeveloped.Withnozzleheatingmodule,laserheatingmodule,UVdispensingandcuringmodule,hotnitrogenshieldinggasmodule,substratepreheatingmodule,processmonitoringmodule,chipflip-chipweldingmodule Withthelaserweldingmodule,itcancompletetherepairofminiLEDflexiblecircuitboards,largemedicalequipment(coreimagingmoduleassembly),opticaldevices(laserLDpalladiumassembly,VCSEL,PD,LENSassembly,etc.),semiconductors(MEMSdevices,RFdevices,microwaves)Devicesandhybridcircuits). Thisseriesofproductshasstableperformance,highcostperformance,andconvenientoperation.Itisespeciallysuitableforscientificresearchinstitutesanduniversitylaboratoriesthatdonotrequirehighproductionefficiencyandhighprecision. Applicationarea： MEMSpackaging Flip-chipbonding Chipbonding MiniLEDMount Opticalmodulepackage Sensorpackage Laserdiodelaserbarwelding MicroASMM-Smanual-semi-automaticmicro-assemblysystem TheM-Splatformisamanual-semi-automaticmicro-assemblysystem.Canbematchedwithnozzleheatingmodule,laserheatingmodule,UVdispensingandcuringmodule,hotnitrogenprotectivegasmodule,substratepreheatingmodule,processmonitoringmodule,andflipchipsolderingmodule. Thisseriesofproductshasstableperformance,highcostperformance,andeasyoperation.Itisespeciallysuitableforscientificresearchinstitutesanduniversitylaboratoriesthatdonotrequirehighproductionefficiencyandhighaccuracyrequirements. Applications:MEMSpackaging,flip-chipbonding,front-chipbonding WaferlevelpackageOpticalmodulepackageSensorpackageMiniLEDplacement AboutMicroASMSemiconductor Boothnumber2Q112Q12 ShenzhenMicroASMSemiconductorTechnologyC
MicroASM Semiconductor Will Bring Micro Assembly System Equipment To Participate In CIOE 2019
(Summary description)GatheringinnovationpowerandintegratingtheentirephotovoltaicindustrychainThe21stChinaInternationalOptoelectronicExposition(CIOE)Willbe September4-7,2019atShenzhenConventionandExhibitionCenter Hold。 ShenzhenMicroASMSemiconductorTechnologyCo.,Ltd.willbringonlinefull-automaticbondingmachineAM-X,offlinefull-automaticsemiconductorstickingmachineAM-S,offlinesemi-automaticmicro-assemblybondingmachineM-5,offlinemanualmicro-assemblyThesystemM-10Sseriesequipmentisgrandlyexhibitedintheexhibitionarea:LaserTechnologyandIntelligentManufacturingExhibitionHall22Q112Q12,sincerelyinvitecolleaguesintheindustrytovisit,exchangeandbusinessnegotiations. Exhibits —————— Boothnumber2Q112Q12 Onlineautomaticmicro-groupsystem TheAM-Xplatformisacompletemicro-assemblysystem.Itscoremoduleintegratesthreeparts:high-precisionplacementsystem,pre-fixationsystemandproductiondataanalysis.Themicro-levelgantrydoubledrivestructurecanbeusedtoformanonlinegenerationsystem. Canbeequippedwithnozzleheatingmodule,tray/waferplacingtray,ultrasonicmodule,laserheatingmodule,UVdispensingandcuringmodule,hotnitrogenandformicacidprocessprotectivegasmodule,basiclow-heatingmodule,processmonitoringmodule,chippourInstalltheweldingmodule. Electronicdevices(MicroLED,miniLEDdisplaychips,metric03015,008004devicesonnext-generationmobilephones),largemedicaldevices(coreimagingmoduleassembly),opticaldevices(laserLDpalladiumassembly,VCSEL,PD,LENS,etc.),Semiconductors(MEMSdevices,RFdevices,microwavedevicesandhybridcircuits)andotherfieldsarewidelyused. TheAM-Xsystemwillrecordtheplacementdataofeachproductinrealtime,andcanfreelyandflexiblyquerytheproductionstatus,andatthesametimeadjusttheplacementcompensationdataaccordingtothedynamicdatatoachievethebestproductionstatus. Applicationareas: MicroLED,miniLEDarraychippatch Microopticalchip,displaychippackage 的Metric03015,008004devicesonnext-generationphones Largemedicalequipment(coreimagingmoduleassembly) Kryptonoptics(laserLDpalladiumassembly,VCSEL,PD,LENSassembly,etc.) Semiconductors(MEMSdevices,RFdevices,microwavedevicesandhybridcircuits) Siliconchip,GaAschip,bulksilicondevice,AlGaInN,etc. Offlinefull-automaticmicro-groupsystem TheAM-Splatformisanofflinefullyautomaticmicro-assemblysystemdevelopedbythecompany,whichcanbeequippedwithanozzleheatingmodule,atray/waferplacingtray,anultrasonicmodule,alaserheatingmodule,aUVdispensingandcuringmodule,hotnitrogenandformicacidprocessesProtectivegasmodule,substratepreheatingmodule,processmonitoringmodule,chipflip-chipsolderingmodule. Theplatformadoptsamarblebridgestructure,anditscoremotion-relatedcomponentsadopttheIsraelimilitarybrandELMOdrivesystemandtheDutchtoplineardrivemotorTECNOTION,whichcanachieve0.1μresolutionand0.5μrepetitivepositioningaccuracyonasingleaxis. Thesoftwaresystemdevelopedbythecompanyintegratesfunctionalmodulessuchasinternalconstanttemperaturecontrol,placementaccuracyself-tuning,andplacementdataanalysis.Wecancustomizetheprocessflow,software,andmodulesfordifferentcustomerneeds,maximizingthein-depthcombinationofequipmentapplicationsandcustomeractualprocess. Applicationarea： MEMSpackaging Flip-chipbonding Chipbonding Waferlevelpackaging Opticalmodulepackage Sensorpackage MiniLEDMount Off-linesemi-automaticmicro-groupsystem TheMplatformisanofflinesemi-automaticmicro-assemblysystem.Basedonthisplatform,threemodelswithdifferentpositioningaccuracyofM5/M10/M20havebeendeveloped.Withnozzleheatingmodule,laserheatingmodule,UVdispensingandcuringmodule,hotnitrogenshieldinggasmodule,substratepreheatingmodule,processmonitoringmodule,chipflip-chipweldingmodule Withthelaserweldingmodule,itcancompletetherepairofminiLEDflexiblecircuitboards,largemedicalequipment(coreimagingmoduleassembly),opticaldevices(laserLDpalladiumassembly,VCSEL,PD,LENSassembly,etc.),semiconductors(MEMSdevices,RFdevices,microwaves)Devicesandhybridcircuits). Thisseriesofproductshasstableperformance,highcostperformance,andconvenientoperation.Itisespeciallysuitableforscientificresearchinstitutesanduniversitylaboratoriesthatdonotrequirehighproductionefficiencyandhighprecision. Applicationarea： MEMSpackaging Flip-chipbonding Chipbonding MiniLEDMount Opticalmodulepackage Sensorpackage Laserdiodelaserbarwelding MicroASMM-Smanual-semi-automaticmicro-assemblysystem TheM-Splatformisamanual-semi-automaticmicro-assemblysystem.Canbematchedwithnozzleheatingmodule,laserheatingmodule,UVdispensingandcuringmodule,hotnitrogenprotectivegasmodule,substratepreheatingmodule,processmonitoringmodule,andflipchipsolderingmodule. Thisseriesofproductshasstableperformance,highcostperformance,andeasyoperation.Itisespeciallysuitableforscientificresearchinstitutesanduniversitylaboratoriesthatdonotrequirehighproductionefficiencyandhighaccuracyrequirements. Applications:MEMSpackaging,flip-chipbonding,front-chipbonding WaferlevelpackageOpticalmodulepackageSensorpackageMiniLEDplacement AboutMicroASMSemiconductor Boothnumber2Q112Q12 ShenzhenMicroASMSemiconductorTechnologyC
- Categories:News Center
- Author:
- Origin:
- Time of issue:2019-11-01
- Views:0
Gathering innovation power and integrating the entire photovoltaic industry chainThe 21st China International Optoelectronic Exposition (CIOE)Will be September 4-7, 2019 at Shenzhen Convention and Exhibition Center Hold。
Shenzhen MicroASM Semiconductor Technology Co., Ltd. will bring online full-automatic bonding machine AM-X, offline full-automatic semiconductor sticking machine AM-S, offline semi-automatic micro-assembly bonding machine M-5, offline manual micro-assembly The system M-10S series equipment is grandly exhibited in the exhibition area: Laser Technology and Intelligent Manufacturing Exhibition Hall 2 2Q11 2Q12, sincerely invite colleagues in the industry to visit, exchange and business negotiations.
Exhibits
——————
Booth number 2Q11 2Q12
The AM-X platform is a complete micro-assembly system. Its core module integrates three parts: high-precision placement system, pre-fixation system and production data analysis. The micro-level gantry double drive structure can be used to form an online generation system.
The AM-X system will record the placement data of each product in real time, and can freely and flexibly query the production status, and at the same time adjust the placement compensation data according to the dynamic data to achieve the best production status.
Offline full-automatic micro-group system
The AM-S platform is an offline fully automatic micro-assembly system developed by the company, which can be equipped with a nozzle heating module, a tray / wafer placing tray, an ultrasonic module, a laser heating module, a UV dispensing and curing module, hot nitrogen and formic acid processes Protective gas module, substrate preheating module, process monitoring module, chip flip-chip soldering module.
The platform adopts a marble bridge structure, and its core motion-related components adopt the Israeli military brand ELMO drive system and the Dutch top linear drive motor TECNOTION, which can achieve 0.1μ resolution and 0.5μ repetitive positioning accuracy on a single axis.
The software system developed by the company integrates functional modules such as internal constant temperature control, placement accuracy self-tuning, and placement data analysis. We can customize the process flow, software, and modules for different customer needs, maximizing the in-depth combination of equipment applications and customer actual process.
Application area：
MEMS packaging Flip-chip bonding
Chip bonding Wafer level packaging
Optical module package Sensor package
Mini LEDMount
Off-line semi-automatic micro-group system
The M platform is an offline semi-automatic micro-assembly system. Based on this platform, three models with different positioning accuracy of M5 / M10 / M20 have been developed. With nozzle heating module, laser heating module, UV dispensing and curing module, hot nitrogen shielding gas module, substrate preheating module, process monitoring module, chip flip-chip welding module
With the laser welding module, it can complete the repair of mini LED flexible circuit boards, large medical equipment (core imaging module assembly), optical devices (laser LD palladium assembly, VCSEL, PD, LENS assembly, etc.), semiconductors (MEMS devices, RF devices, microwaves) Devices and hybrid circuits).
This series of products has stable performance, high cost performance, and convenient operation. It is especially suitable for scientific research institutes and university laboratories that do not require high production efficiency and high precision.
Application area：
MEMS packaging Flip-chip bonding
Chip bonding Mini LEDMount
Optical module package Sensor package
Laser diode laser bar welding
MicroASM M-S manual-semi-automatic micro-assembly system
The M-S platform is a manual-semi-automatic micro-assembly system. Can be matched with nozzle heating module, laser heating module, UV dispensing and curing module, hot nitrogen protective gas module, substrate preheating module, process monitoring module, and flip chip soldering module.
About MicroASM Semiconductor
Booth number 2Q11 2Q12
Shenzhen MicroASM Semiconductor Technology Co., Ltd. has been deeply cultivating semiconductor MicroASM equipment, BGA rework equipment, automated custom equipment, stick machines, video inspection equipment, surface mount peripheral equipment, flip-chip bonding machines, Die Bonder equipment, etc. , And continue to bring more efficient and better integrated solutions to industry customers.
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Products
MicroASM AMX full-function sticky machine
MicroASM AMS Flip Bonder
Micro group MicroASM M micro assembly bonding machine
MicroASM M-10S Micro Assembly Bonding Machine
AM series Mini LED full-automatic laser repair equipment
Effective ShuttleStar SV-2000A
Effective ShuttleStar RW-E6250U
Effective ShuttleStar RW-SV560A
Effective ShuttleStar RW-SV550
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Company email：sales@microasm.com
Office Headquarters: 401, Building 6, Country Garden Plant, No. 2 Eighth Road, Yangyong Industrial Zone, Shapu Community, Songgang Street, Bao'an District, Shenzhen
Office: Yangyong Industrial Zone, Shapu Community, Songgang Street, Baoan District, Shenzhen
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