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MicroASM Semiconductor Will Bring Micro Assembly System Equipment To Participate In CIOE 2019

MicroASM Semiconductor Will Bring Micro Assembly System Equipment To Participate In CIOE 2019

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  • Time of issue:2019-11-01
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(Summary description)GatheringinnovationpowerandintegratingtheentirephotovoltaicindustrychainThe21stChinaInternationalOptoelectronicExposition(CIOE)Willbe September4-7,2019atShenzhenConventionandExhibitionCenter Hold。  ShenzhenMicroASMSemiconductorTechnologyCo.,Ltd.willbringonlinefull-automaticbondingmachineAM-X,offlinefull-automaticsemiconductorstickingmachineAM-S,offlinesemi-automaticmicro-assemblybondingmachineM-5,offlinemanualmicro-assemblyThesystemM-10Sseriesequipmentisgrandlyexhibitedintheexhibitionarea:LaserTechnologyandIntelligentManufacturingExhibitionHall22Q112Q12,sincerelyinvitecolleaguesintheindustrytovisit,exchangeandbusinessnegotiations.  Exhibits  ——————  Boothnumber2Q112Q12 Onlineautomaticmicro-groupsystem TheAM-Xplatformisacompletemicro-assemblysystem.Itscoremoduleintegratesthreeparts:high-precisionplacementsystem,pre-fixationsystemandproductiondataanalysis.Themicro-levelgantrydoubledrivestructurecanbeusedtoformanonlinegenerationsystem. Canbeequippedwithnozzleheatingmodule,tray/waferplacingtray,ultrasonicmodule,laserheatingmodule,UVdispensingandcuringmodule,hotnitrogenandformicacidprocessprotectivegasmodule,basiclow-heatingmodule,processmonitoringmodule,chippourInstalltheweldingmodule. Electronicdevices(MicroLED,miniLEDdisplaychips,metric03015,008004devicesonnext-generationmobilephones),largemedicaldevices(coreimagingmoduleassembly),opticaldevices(laserLDpalladiumassembly,VCSEL,PD,LENS,etc.),Semiconductors(MEMSdevices,RFdevices,microwavedevicesandhybridcircuits)andotherfieldsarewidelyused.  TheAM-Xsystemwillrecordtheplacementdataofeachproductinrealtime,andcanfreelyandflexiblyquerytheproductionstatus,andatthesametimeadjusttheplacementcompensationdataaccordingtothedynamicdatatoachievethebestproductionstatus. Applicationareas: MicroLED,miniLEDarraychippatch Microopticalchip,displaychippackage 的Metric03015,008004devicesonnext-generationphones Largemedicalequipment(coreimagingmoduleassembly) Kryptonoptics(laserLDpalladiumassembly,VCSEL,PD,LENSassembly,etc.) Semiconductors(MEMSdevices,RFdevices,microwavedevicesandhybridcircuits) Siliconchip,GaAschip,bulksilicondevice,AlGaInN,etc.  Offlinefull-automaticmicro-groupsystem  TheAM-Splatformisanofflinefullyautomaticmicro-assemblysystemdevelopedbythecompany,whichcanbeequippedwithanozzleheatingmodule,atray/waferplacingtray,anultrasonicmodule,alaserheatingmodule,aUVdispensingandcuringmodule,hotnitrogenandformicacidprocessesProtectivegasmodule,substratepreheatingmodule,processmonitoringmodule,chipflip-chipsolderingmodule.  Theplatformadoptsamarblebridgestructure,anditscoremotion-relatedcomponentsadopttheIsraelimilitarybrandELMOdrivesystemandtheDutchtoplineardrivemotorTECNOTION,whichcanachieve0.1μresolutionand0.5μrepetitivepositioningaccuracyonasingleaxis.  Thesoftwaresystemdevelopedbythecompanyintegratesfunctionalmodulessuchasinternalconstanttemperaturecontrol,placementaccuracyself-tuning,andplacementdataanalysis.Wecancustomizetheprocessflow,software,andmodulesfordifferentcustomerneeds,maximizingthein-depthcombinationofequipmentapplicationsandcustomeractualprocess.  Applicationarea:  MEMSpackaging           Flip-chipbonding  Chipbonding           Waferlevelpackaging  Opticalmodulepackage        Sensorpackage  MiniLEDMount   Off-linesemi-automaticmicro-groupsystem  TheMplatformisanofflinesemi-automaticmicro-assemblysystem.Basedonthisplatform,threemodelswithdifferentpositioningaccuracyofM5/M10/M20havebeendeveloped.Withnozzleheatingmodule,laserheatingmodule,UVdispensingandcuringmodule,hotnitrogenshieldinggasmodule,substratepreheatingmodule,processmonitoringmodule,chipflip-chipweldingmodule  Withthelaserweldingmodule,itcancompletetherepairofminiLEDflexiblecircuitboards,largemedicalequipment(coreimagingmoduleassembly),opticaldevices(laserLDpalladiumassembly,VCSEL,PD,LENSassembly,etc.),semiconductors(MEMSdevices,RFdevices,microwaves)Devicesandhybridcircuits).  Thisseriesofproductshasstableperformance,highcostperformance,andconvenientoperation.Itisespeciallysuitableforscientificresearchinstitutesanduniversitylaboratoriesthatdonotrequirehighproductionefficiencyandhighprecision.  Applicationarea:  MEMSpackaging          Flip-chipbonding  Chipbonding           MiniLEDMount  Opticalmodulepackage       Sensorpackage  Laserdiodelaserbarwelding           MicroASMM-Smanual-semi-automaticmicro-assemblysystem  TheM-Splatformisamanual-semi-automaticmicro-assemblysystem.Canbematchedwithnozzleheatingmodule,laserheatingmodule,UVdispensingandcuringmodule,hotnitrogenprotectivegasmodule,substratepreheatingmodule,processmonitoringmodule,andflipchipsolderingmodule. Thisseriesofproductshasstableperformance,highcostperformance,andeasyoperation.Itisespeciallysuitableforscientificresearchinstitutesanduniversitylaboratoriesthatdonotrequirehighproductionefficiencyandhighaccuracyrequirements. Applications:MEMSpackaging,flip-chipbonding,front-chipbonding WaferlevelpackageOpticalmodulepackageSensorpackageMiniLEDplacement  AboutMicroASMSemiconductor   Boothnumber2Q112Q12  ShenzhenMicroASMSemiconductorTechnologyC

MicroASM Semiconductor Will Bring Micro Assembly System Equipment To Participate In CIOE 2019

(Summary description)GatheringinnovationpowerandintegratingtheentirephotovoltaicindustrychainThe21stChinaInternationalOptoelectronicExposition(CIOE)Willbe September4-7,2019atShenzhenConventionandExhibitionCenter Hold。  ShenzhenMicroASMSemiconductorTechnologyCo.,Ltd.willbringonlinefull-automaticbondingmachineAM-X,offlinefull-automaticsemiconductorstickingmachineAM-S,offlinesemi-automaticmicro-assemblybondingmachineM-5,offlinemanualmicro-assemblyThesystemM-10Sseriesequipmentisgrandlyexhibitedintheexhibitionarea:LaserTechnologyandIntelligentManufacturingExhibitionHall22Q112Q12,sincerelyinvitecolleaguesintheindustrytovisit,exchangeandbusinessnegotiations.  Exhibits  ——————  Boothnumber2Q112Q12 Onlineautomaticmicro-groupsystem TheAM-Xplatformisacompletemicro-assemblysystem.Itscoremoduleintegratesthreeparts:high-precisionplacementsystem,pre-fixationsystemandproductiondataanalysis.Themicro-levelgantrydoubledrivestructurecanbeusedtoformanonlinegenerationsystem. Canbeequippedwithnozzleheatingmodule,tray/waferplacingtray,ultrasonicmodule,laserheatingmodule,UVdispensingandcuringmodule,hotnitrogenandformicacidprocessprotectivegasmodule,basiclow-heatingmodule,processmonitoringmodule,chippourInstalltheweldingmodule. Electronicdevices(MicroLED,miniLEDdisplaychips,metric03015,008004devicesonnext-generationmobilephones),largemedicaldevices(coreimagingmoduleassembly),opticaldevices(laserLDpalladiumassembly,VCSEL,PD,LENS,etc.),Semiconductors(MEMSdevices,RFdevices,microwavedevicesandhybridcircuits)andotherfieldsarewidelyused.  TheAM-Xsystemwillrecordtheplacementdataofeachproductinrealtime,andcanfreelyandflexiblyquerytheproductionstatus,andatthesametimeadjusttheplacementcompensationdataaccordingtothedynamicdatatoachievethebestproductionstatus. Applicationareas: MicroLED,miniLEDarraychippatch Microopticalchip,displaychippackage 的Metric03015,008004devicesonnext-generationphones Largemedicalequipment(coreimagingmoduleassembly) Kryptonoptics(laserLDpalladiumassembly,VCSEL,PD,LENSassembly,etc.) Semiconductors(MEMSdevices,RFdevices,microwavedevicesandhybridcircuits) Siliconchip,GaAschip,bulksilicondevice,AlGaInN,etc.  Offlinefull-automaticmicro-groupsystem  TheAM-Splatformisanofflinefullyautomaticmicro-assemblysystemdevelopedbythecompany,whichcanbeequippedwithanozzleheatingmodule,atray/waferplacingtray,anultrasonicmodule,alaserheatingmodule,aUVdispensingandcuringmodule,hotnitrogenandformicacidprocessesProtectivegasmodule,substratepreheatingmodule,processmonitoringmodule,chipflip-chipsolderingmodule.  Theplatformadoptsamarblebridgestructure,anditscoremotion-relatedcomponentsadopttheIsraelimilitarybrandELMOdrivesystemandtheDutchtoplineardrivemotorTECNOTION,whichcanachieve0.1μresolutionand0.5μrepetitivepositioningaccuracyonasingleaxis.  Thesoftwaresystemdevelopedbythecompanyintegratesfunctionalmodulessuchasinternalconstanttemperaturecontrol,placementaccuracyself-tuning,andplacementdataanalysis.Wecancustomizetheprocessflow,software,andmodulesfordifferentcustomerneeds,maximizingthein-depthcombinationofequipmentapplicationsandcustomeractualprocess.  Applicationarea:  MEMSpackaging           Flip-chipbonding  Chipbonding           Waferlevelpackaging  Opticalmodulepackage        Sensorpackage  MiniLEDMount   Off-linesemi-automaticmicro-groupsystem  TheMplatformisanofflinesemi-automaticmicro-assemblysystem.Basedonthisplatform,threemodelswithdifferentpositioningaccuracyofM5/M10/M20havebeendeveloped.Withnozzleheatingmodule,laserheatingmodule,UVdispensingandcuringmodule,hotnitrogenshieldinggasmodule,substratepreheatingmodule,processmonitoringmodule,chipflip-chipweldingmodule  Withthelaserweldingmodule,itcancompletetherepairofminiLEDflexiblecircuitboards,largemedicalequipment(coreimagingmoduleassembly),opticaldevices(laserLDpalladiumassembly,VCSEL,PD,LENSassembly,etc.),semiconductors(MEMSdevices,RFdevices,microwaves)Devicesandhybridcircuits).  Thisseriesofproductshasstableperformance,highcostperformance,andconvenientoperation.Itisespeciallysuitableforscientificresearchinstitutesanduniversitylaboratoriesthatdonotrequirehighproductionefficiencyandhighprecision.  Applicationarea:  MEMSpackaging          Flip-chipbonding  Chipbonding           MiniLEDMount  Opticalmodulepackage       Sensorpackage  Laserdiodelaserbarwelding           MicroASMM-Smanual-semi-automaticmicro-assemblysystem  TheM-Splatformisamanual-semi-automaticmicro-assemblysystem.Canbematchedwithnozzleheatingmodule,laserheatingmodule,UVdispensingandcuringmodule,hotnitrogenprotectivegasmodule,substratepreheatingmodule,processmonitoringmodule,andflipchipsolderingmodule. Thisseriesofproductshasstableperformance,highcostperformance,andeasyoperation.Itisespeciallysuitableforscientificresearchinstitutesanduniversitylaboratoriesthatdonotrequirehighproductionefficiencyandhighaccuracyrequirements. Applications:MEMSpackaging,flip-chipbonding,front-chipbonding WaferlevelpackageOpticalmodulepackageSensorpackageMiniLEDplacement  AboutMicroASMSemiconductor   Boothnumber2Q112Q12  ShenzhenMicroASMSemiconductorTechnologyC

  • Categories:News Center
  • Author:
  • Origin:
  • Time of issue:2019-11-01
  • Views:0
Information

  Gathering innovation power and integrating the entire photovoltaic industry chainThe 21st China International Optoelectronic Exposition (CIOE)Will be September 4-7, 2019 at Shenzhen Convention and Exhibition Center Hold。

  Shenzhen MicroASM Semiconductor Technology Co., Ltd. will bring online full-automatic bonding machine AM-X, offline full-automatic semiconductor sticking machine AM-S, offline semi-automatic micro-assembly bonding machine M-5, offline manual micro-assembly The system M-10S series equipment is grandly exhibited in the exhibition area: Laser Technology and Intelligent Manufacturing Exhibition Hall 2 2Q11 2Q12, sincerely invite colleagues in the industry to visit, exchange and business negotiations.

  Exhibits

  ——————

  Booth number 2Q11 2Q12

 
Online automatic micro-group system

1

 The AM-X platform is a complete micro-assembly system. Its core module integrates three parts: high-precision placement system, pre-fixation system and production data analysis. The micro-level gantry double drive structure can be used to form an online generation system.

 
Can be equipped with nozzle heating module, tray / wafer placing tray, ultrasonic module, laser heating module, UV dispensing and curing module, hot nitrogen and formic acid process protective gas module, basic low-heating module, process monitoring module, chip pour Install the welding module.
 
Electronic devices (Micro LED, miniLED display chips, metric 03015, 008004 devices on next-generation mobile phones), large medical devices (core imaging module assembly), optical devices (laser LD palladium assembly, VCSEL, PD, LENS, etc.) , Semiconductors (MEMS devices, RF devices, microwave devices and hybrid circuits) and other fields are widely used.

  The AM-X system will record the placement data of each product in real time, and can freely and flexibly query the production status, and at the same time adjust the placement compensation data according to the dynamic data to achieve the best production status.

 
Application areas:
 
Micro LED, miniLED array chip patch
 
Micro optical chip, display chip package
 
的 Metric 03015, 008004 devices on next-generation phones
 
Large medical equipment (core imaging module assembly)
 
Krypton optics (laser LD palladium assembly, VCSEL, PD, LENS assembly, etc.)
 
Semiconductors (MEMS devices, RF devices, microwave devices and hybrid circuits)
 
Silicon chip, GaAs chip, bulk silicon device, AlGaInN, etc.

  Offline full-automatic micro-group system

  The AM-S platform is an offline fully automatic micro-assembly system developed by the company, which can be equipped with a nozzle heating module, a tray / wafer placing tray, an ultrasonic module, a laser heating module, a UV dispensing and curing module, hot nitrogen and formic acid processes Protective gas module, substrate preheating module, process monitoring module, chip flip-chip soldering module.

  The platform adopts a marble bridge structure, and its core motion-related components adopt the Israeli military brand ELMO drive system and the Dutch top linear drive motor TECNOTION, which can achieve 0.1μ resolution and 0.5μ repetitive positioning accuracy on a single axis.

  The software system developed by the company integrates functional modules such as internal constant temperature control, placement accuracy self-tuning, and placement data analysis. We can customize the process flow, software, and modules for different customer needs, maximizing the in-depth combination of equipment applications and customer actual process.

  Application area:

  MEMS packaging                     Flip-chip bonding

  Chip bonding                      Wafer level packaging

  Optical module package               Sensor package

  Mini LEDMount

 

  Off-line semi-automatic micro-group system

  The M platform is an offline semi-automatic micro-assembly system. Based on this platform, three models with different positioning accuracy of M5 / M10 / M20 have been developed. With nozzle heating module, laser heating module, UV dispensing and curing module, hot nitrogen shielding gas module, substrate preheating module, process monitoring module, chip flip-chip welding module

  With the laser welding module, it can complete the repair of mini LED flexible circuit boards, large medical equipment (core imaging module assembly), optical devices (laser LD palladium assembly, VCSEL, PD, LENS assembly, etc.), semiconductors (MEMS devices, RF devices, microwaves) Devices and hybrid circuits).

  This series of products has stable performance, high cost performance, and convenient operation. It is especially suitable for scientific research institutes and university laboratories that do not require high production efficiency and high precision.

  Application area:

  MEMS packaging                    Flip-chip bonding

  Chip bonding                     Mini LEDMount

  Optical module package               Sensor package

  Laser diode laser bar welding

 

                MicroASM M-S manual-semi-automatic micro-assembly system

  The M-S platform is a manual-semi-automatic micro-assembly system. Can be matched with nozzle heating module, laser heating module, UV dispensing and curing module, hot nitrogen protective gas module, substrate preheating module, process monitoring module, and flip chip soldering module.

 
This series of products has stable performance, high cost performance, and easy operation. It is especially suitable for scientific research institutes and university laboratories that do not require high production efficiency and high accuracy requirements.
 
Applications: MEMS packaging, flip-chip bonding, front-chip bonding
 
Wafer level package Optical module package Sensor package Mini LED placement

  About MicroASM Semiconductor

 

  Booth number 2Q11 2Q12

  Shenzhen MicroASM Semiconductor Technology Co., Ltd. has been deeply cultivating semiconductor MicroASM equipment, BGA rework equipment, automated custom equipment, stick machines, video inspection equipment, surface mount peripheral equipment, flip-chip bonding machines, Die Bonder equipment, etc. , And continue to bring more efficient and better integrated solutions to industry customers.

 

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Office  Headquarters: 401, Building 6, Country Garden Plant, No. 2 Eighth Road, Yangyong Industrial Zone, Shapu Community, Songgang Street, Bao'an District, Shenzhen

Office: Yangyong Industrial Zone, Shapu Community, Songgang Street, Baoan District, Shenzhen

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