MicroASM Semiconductor Will Bring Micro Assembly System Equipment To Participate In CIOE 2019
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- Time of issue:2019-12-13
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(Summary description)The21stChinaInternationalOptoelectronicExposition(CIOE)thatgathersinnovationpowerandintegratestheentireoptoelectronicindustrychainwillbeheldattheShenzhenConventionandExhibitionCenteronSeptember4-7,2019.
MicroASM Semiconductor Will Bring Micro Assembly System Equipment To Participate In CIOE 2019
(Summary description)The21stChinaInternationalOptoelectronicExposition(CIOE)thatgathersinnovationpowerandintegratestheentireoptoelectronicindustrychainwillbeheldattheShenzhenConventionandExhibitionCenteronSeptember4-7,2019.
- Categories:News Center
- Author:
- Origin:
- Time of issue:2019-12-13
- Views:0
The 21st China International Optoelectronic Exposition (CIOE) that gathers innovation power and integrates the entire optoelectronic industry chain will be held at the Shenzhen Convention and Exhibition Center on September 4-7, 2019.
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Products
MicroASM AMX full-function sticky machine
MicroASM AMS Flip Bonder
Micro group MicroASM M micro assembly bonding machine
MicroASM M-10S Micro Assembly Bonding Machine
AM series Mini LED full-automatic laser repair equipment
Effective ShuttleStar SV-2000A
Effective ShuttleStar RW-E6250U
Effective ShuttleStar RW-SV560A
Effective ShuttleStar RW-SV550
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