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MicroASM AMS invert bonding machine
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MicroASM AMS invert bonding machine

AM-S platform is an off-line automatic micro assembly system developed by the company, which can be equipped with nozzle heating module, material tray/wafer placing plate, ultrasonic module, laser heating module, UV dispensing and curing module, hot nitrogen and formic acid process protection gas module, base preheating module, process monitoring module, chip flip welding module.
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AM-S platform is an off-line automatic micro assembly system developed by the company, which can be equipped with nozzle heating module, material tray/wafer placing plate, ultrasonic module, laser heating module, UV dispensing and curing module, hot nitrogen and formic acid process protection gas module, base preheating module, process monitoring module, chip flip welding module. 

 The platform features a marble bridge structure and core motion-related components from the Israeli military brand ELMO drive system and TECNOTION, a top line Dutch linear drive motor which achieves a 0.1 μ resolution and 0.5 μ single-axis repeat positioning accuracy. 

Company's software system integrates equipment internal temperature control, mount precision self-tuning, mount data analysis and other functional modules. We can customize the process, software and module for different customer requirements, and combine the application of equipment with the actual process depth of customers.

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type

AM-5S

AM-10S

Lighting system

RGB panchromatic ring light source

Mounting accuracay

 ±2.5μm 3sigma

±5μm 3sigma

 Process monitoring system (optional)

Can be record

Way of work

 

Off-line automatic 

Off-line automatic 

 Gripper pickup tool head

    customized   

Operating range

200*300mm 

200*300mm

Suction nozzle

   customized  

 Mount device size range

0.03-40mm

0.03-40mm

  Fixed feeding method 

Gel-pack,Tray,Waferpack etc,

Comprehensive mounting accuracy

±2.5μm 3sigma

±5μm 3sigma

Eutectic module (optional)

30℃～500

 XY driven form

Linear motor

Linear motor

 Process protection gas (optional) 

 Hot nitrogen

 Displacement

distance

X:300mm Y:350mm

X:300mm Y:350mm

 Dispensing system (optional) 

Musashi  dispensing system is compatible with UV dispensing, epoxy dispensing and silver dispensing

 

Z:150mm  T:360°

 Z:150mm  T:360°

 Curing system (optional)

 Uv curing/heat curing

XY resolution

 0.5μ

1μ

Height measurement (optional)

 0.005mm Keenshi laser measures 0.005 mm

Z resolution

 0.5μ

1μ

 Laser hot pressing bonding system (optional)

 MicroASM 25-1000℃

 T resolution

0.003°

0.005°

 Ultrasonic hot pressing bonding system (optional)

MicroASM 25~450℃

 Bonding force control

 20-500g 

20-500g 

Access requirements

220 power 10a0.5 mpa compressed air   

Upper visual system

1μ

2μ

Dimensions and weight 

1050X1550X1850mm(not including monitor)1800kg

 Lower visual system

 1μ 

 2μ 

weight

1000kg

 

 

 

MEMS encapsulation

Flip chip bonding

Formal chip bonding

Wafer level package

Optical module package

Sensor package

Mini LED mounting

Laser heating

Adhesive technology

Curing (uv, temperature)

Eutectic welding gold tin and indium

Mems assembly

Hot pressing

Wafer level high precision adhesive

Function modules can be customized according to different customer needs

Can be customized according to different customer requirements process

Wafer level high precision chip mount   

The machine can be assembled automatically without the influence of human factors

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Contact

URL：http://www.microasm.com

Company email：sales@microasm.com
Office  Headquarters: 401, Building 6, Country Garden Plant, No. 2 Eighth Road, Yangyong Industrial Zone, Shapu Community, Songgang Street, Bao'an District, Shenzhen

Office: Yangyong Industrial Zone, Shapu Community, Songgang Street, Baoan District, Shenzhen

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