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MicroASM AMX full-function Die-Bonder
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MicroASM AMX full-function Die-Bonder

AM-X platform is a complete micro assembly system. Its core module integrates three parts: high-precision mount system, prefix system and production data analysis. The double drive structure of micron gantry can be conveniently composed and generated online.　　 It can be equipped with nozzle heating module, material plate/wafer placing plate, ultrasonic module, laser heating module, UV dispensing and curing module, hot nitrogen and formic acid process protection gas module, base preheating module, process monitoring module, chip flip welding module.
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MicroASM AMX full-function Die-Bonder

AM-X platform is a complete micro assembly system. Its core module integrates three parts: high-precision mount system, prefix system and production data analysis. The double drive structure of micron gantry can be conveniently composed and generated online.　　                                 

It can be equipped with nozzle heating module, material plate/wafer placing plate, ultrasonic module, laser heating module, UV dispensing and curing module, hot nitrogen and formic acid process protection gas module, base preheating module, process monitoring module, chip flip welding module.

It is widely used in electronic equipment (Micro LED, mini LED display chip, metric 03015, 008004 on the next generation mobile phone), medical equipment (CT imaging module assembly), optical devices (Laser LD PD bar assembly, VCSEL, PD, LENS assembly, etc.), semiconductor (MEMS devices, Rf devices, microwave devices and hybrid circuits) and other fields.

The AM-X system will record the mount data of each product in real time, so that the production status can be inquired freely and flexibly, and the mount compensation data can be adjusted according to the dynamic data to achieve the best production status.

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type

AM-5X

AM-10X

 Lighting system

RGB panchromatic ring light source

Mounting accuracy

 ±2.5μm 3sigma

±5μm 3sigma

 Process monitoring system (optional)

Can be record

Wy of work

Online full-automatic  

Online full-automatic 

Gripper pickup tool head

 customized   

Operating range

400*800mm

400*800mm

MagazineTransfer System(optional)

customized 

 Mount device size range

0.03-100mm

0.03-100mm

Cassette (optional) 

  25 pieces of the standard

 Comprehensive mounting accuracy

±2.5μm 3sigma

±5μm 3sigma

 Wafer table(optional) 

 Compatible with 8 inches, 6 inches and 4 inches

XY driven form

Linear motor

 Linear motor

WaferTransfer System(optional)

 standard

travel

X:400mm Y:900mm

X:400mm Y:900mm

Fixed feeding method 

Gel - pack, Tray, Waferpack, feeder, etc., support customization

 

Z:80mm  T:360°

 Z:80mm  T:360°

 Process protection gas (optional) 

Hot nitrogen/formic acid

XY axis  resolution

 

 0.5μ

1μ

Dispensing system (optional)

Musashi dispensing system is compatible with UV dispensing, epoxy dispensing and silver dispensing

Z axis  resolution

 0.5μ

1μ

Curing system (optional)

UV  curing/heat curing

T axis  resolution

0.003°

0.005°

 Eutectic welding system with friction function (optional)）

X/Y/45° friction welding 25~500 ° c

Bonding force control

 

 20-500g 

20-500g 

Laser hot pressing bonding system (optional)

 MicroASM 25-1000℃   

upper visual system

1μ

2μ

  Access requirements

220 V 10A 0.5 mpa compressed air

Lower visual system

 1μ 

 2μ 

Dimensions and weight

1050X1550X1850mm(not including monitor)1800kg

 

 

 Micro LED, mini LED array chip mounting

Microchip, display chip package 

Metric 03015, 008004 on next generation mobile phones

Medical equipment (CT imaging module assembly)

Optical devices (Laser LD PD bar assembly, VCSEL, PD, LENS, etc.)

Semiconductor (MEMS devices, Rf devices, microwave devices and hybrid circuits)

Silicon chips, GaAs chips, AlGaInN, etc

Laser heating

Adhesive technology

Curing (UV, heating)

Reflow welding \ eutectic, tin gold, indium

Mems assembly

Hot pressing

Ultrasonic welding heat

Online full-automatic operation, high production efficiency

Integration of high precision mount system, prefix system and production data analysis system

Record the mounting data of each product and inquire the production status in real time

Man-machine friendly interface is easy to operate and easy to program   

Machine intelligence controls all process related parameters: pressure, temperature, time, power, light source and image, and process environment 

According to the needs of the free collocation of relevant functional modules: laser heating module, suction nozzle heating module, UV dispensing and curing module

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URL：http://www.microasm.com

Company email：sales@microasm.com
Office  Headquarters: 401, Building 6, Country Garden Plant, No. 2 Eighth Road, Yangyong Industrial Zone, Shapu Community, Songgang Street, Bao'an District, Shenzhen

Office: Yangyong Industrial Zone, Shapu Community, Songgang Street, Baoan District, Shenzhen

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