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MicroASM M micro assembly bonding machine
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MicroASM M micro assembly bonding machine

M platform is an off-line semi-automatic micro-assembly system. Based on this platform, three models of M5/M10/M20 with different positioning accuracy were developed. Equipped with nozzle heating module, laser heating module, UV dispensing and curing module, hot nitrogen protection gas module, base preheating module, process monitoring module, chip flip welding module.
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M platform is an off-line semi-automatic micro-assembly system. Based on this platform, three models of M5/M10/M20 with different positioning accuracy were developed. Equipped with nozzle heating module, laser heating module, UV dispensing and curing module, hot nitrogen protection gas module, base preheating module, process monitoring module, chip flip welding module.

With the laser welding module, it can complete mini LED flexible circuit board repair, large medical equipment (core imaging module assembly), optical devices (Laser LD Pd bar assembly, VCSEL, PD, LENS assembly, etc.), semiconductor (MEMS devices, Rf devices, microwave devices and hybrid circuits).

This series of products have stable performance, high cost performance and convenient operation, especially suitable for scientific research institutes and academic laboratories that require low production efficiency and high precision.

 

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Working mode off-line semi-automatic

 Z axis travel 150mm

400*800mm Operating range 400*800mm   

 T-axis travel 360°

0.05-40mm The device size range is 0.05-40mm

XY axis resolution 2μ

Comprehensive mounting accuracy ±1μ 3σ    

Z axis resolution 2μ 

XY drive linear motor        

T axis resolution 0.01°

The bonding force controls 20-1000g      

The upper visual system resolution is 1.4μ

The process monitoring system can record and take pictures 

Lower visual system resolution 1.4μ

MEMS encapsulation

Flip chip bonding

Formal chip bonding

 Laser diode laser bar welding

Optical module package

Sensor package

The Mini LED mount

Laser heating

Adhesive technology

Curing (uv, temperature)

Eutectic welding gold tin and indium

Laser bar packaging

Hot pressing

Wafer level high precision adhesive

Off-line semi-automatic operation, easy to operate and cost-effective

High repeatability and application flexibility

Customized function modules and development process according to customer needs

Real-time observation and feedback greatly reduce process development time

Rapid realization of the research and development process to the production process to ensure reliable results

Man-machine friendly interface is easy to operate and easy to program

Control all process related parameters: pressure, temperature, time, power, light source and image, process environment, etc

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URL:http://www.microasm.com

Company email:sales@microasm.com
Office  Headquarters: 401, Building 6, Country Garden Plant, No. 2 Eighth Road, Yangyong Industrial Zone, Shapu Community, Songgang Street, Bao'an District, Shenzhen

Office: Yangyong Industrial Zone, Shapu Community, Songgang Street, Baoan District, Shenzhen

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