OUR PRODUCTS
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MicroASM AMX full-function sticky machine
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MicroASM AMS Flip Bonder
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Micro group MicroASM M micro assembly bonding machine
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MicroASM M-10S Micro Assembly Bonding Machine
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AM series Mini LED full-automatic laser repair equipment
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Effective ShuttleStar SV-2000A
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Effective ShuttleStar RW-E6250U
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Effective ShuttleStar RW-SV560A
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Effective ShuttleStar RW-SV550
MicroASM M micro assembly bonding machine
M platform is an off-line semi-automatic micro-assembly system. Based on this platform, three models of M5/M10/M20 with different positioning accuracy were developed. Equipped with nozzle heating module, laser heating module, UV dispensing and curing module, hot nitrogen protection gas module, base preheating module, process monitoring module, chip flip welding module.
With the laser welding module, it can complete mini LED flexible circuit board repair, large medical equipment (core imaging module assembly), optical devices (Laser LD Pd bar assembly, VCSEL, PD, LENS assembly, etc.), semiconductor (MEMS devices, Rf devices, microwave devices and hybrid circuits).
This series of products have stable performance, high cost performance and convenient operation, especially suitable for scientific research institutes and academic laboratories that require low production efficiency and high precision.
Products
MicroASM AMX full-function sticky machine
MicroASM AMS Flip Bonder
Micro group MicroASM M micro assembly bonding machine
MicroASM M-10S Micro Assembly Bonding Machine
AM series Mini LED full-automatic laser repair equipment
Effective ShuttleStar SV-2000A
Effective ShuttleStar RW-E6250U
Effective ShuttleStar RW-SV560A
Effective ShuttleStar RW-SV550
Contact
Company email:sales@microasm.com
Office Headquarters: 401, Building 6, Country Garden Plant, No. 2 Eighth Road, Yangyong Industrial Zone, Shapu Community, Songgang Street, Bao'an District, Shenzhen
Office: Yangyong Industrial Zone, Shapu Community, Songgang Street, Baoan District, Shenzhen

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