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MicroASM M-10S micro-assembly bonding machine
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MicroASM M-10S micro-assembly bonding machine

The M-s platform is a manual - semi-automatic micro-assembly system. Based on this platform, three models of M5S/M10S/M20S with different positioning accuracy were developed. Equipped with nozzle heating module, laser heating module, UV dispensing and curing module, hot nitrogen protection gas module, base preheating module, process monitoring module, chip flip welding module.
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The M-s platform is a manual - semi-automatic micro-assembly system. Based on this platform, three models of M5S/M10S/M20S with different positioning accuracy were developed. Equipped with nozzle heating module, laser heating module, UV dispensing and curing module, hot nitrogen protection gas module, base preheating module, process monitoring module, chip flip welding module.

With the laser welding module, mini LED flexible circuit board can be repaired, large medical equipment (core imaging module assembly), optical devices (LD PD bar assembly, VCSEL, PD, LENS assembly, etc.), semiconductor (MEMS devices, Rf devices, microwave devices and hybrid circuits).

This series of products have stable performance, high cost performance and convenient operation, especially suitable for scientific research institutes and academic laboratories that require low production efficiency and high precision.

 

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type

M-10S 

Process monitoring system (optional)

It can measure length and area

Way to work

Desktop manual - semi-automatic

Pick up tool head (clamping type)

customized

The scope of work

15*80mm

Suction nozzle

customized

Mount device size range

0.03~20mm

Process protection gas (optional)

 Hot nitrogen

Comprehensive mounting accuracy

±5μm3sigma 

Dispensing system (optional)

Musashi dispensing system is compatible with UV dispensing, epoxy dispensing and silver dispensing

XY driven form

Stepper motor + ball screw

Curing system (optional)

  UV curing/heat curing

T axis stroke

±10°

Height measurement (optional)

  KEYENCE laser measures 0.005 mm

XY axis resolution

1μm

Laser hot pressing bonding system (optional)

Microasm25-1000°

Z axis resolution

1μm

 Ultrasonic hot pressing bonding system (optional)

 Microasm25-500°

T axis resolution

manual

Access requirements

220V power 10A0.5Mpa compressed air

Bonding force control

 20-1000g  

Overall dimensions

 Length X width X height :500X400X650mm

lighting system

White/yellow ring light source

Weight

30kg 

 

 

 

 

MEMS encapsulation

Flip chip bonding

Formal chip bonding

 Laser diode laser bar welding

Optical module package

Sensor package

The Mini LED mount

Laser heating

Adhesive technology

Curing (uv, temperature)

Eutectic welding gold tin and indium

Laser bar packaging

Hot pressing

Wafer level high precision adhesive

Manual - semi-automatic operation, easy to operate and cost-effective

High repeatability and application flexibility

Customized function modules and development process according to customer needs

Real-time observation and feedback greatly reduce process development time

Rapid realization of the research and development process to the production process to ensure reliable results

Man-machine friendly interface is easy to operate and easy to program

Can control all process related parameters: pressure, temperature, time, power, light source and image, process environment, etc.

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URL:http://www.microasm.com

Company email:sales@microasm.com
Office  Headquarters: 401, Building 6, Country Garden Plant, No. 2 Eighth Road, Yangyong Industrial Zone, Shapu Community, Songgang Street, Bao'an District, Shenzhen

Office: Yangyong Industrial Zone, Shapu Community, Songgang Street, Baoan District, Shenzhen

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