PCB size        W20*D20 ~ W540*D450 mm  

Processing range W540*450 mm

PCB thickness   0.5 ~ 4mm                      

Suitable chip   1*1 ~ 80*80mm

Mounting accuracy  ±0.05mm                 

Minimum spacing    0.15mm

Degree of automation  Intelligent full-automatic               

Visual alignment system      High definition

Heating zone        three temperature zones                  

Temperature  curve    upper and lower eight temperature zones

Temperature measurement channel    Five                    

Interface     The man-machine interface is displayed both in English and Chinese

Industrial computer, set-top box, vehicle-mounted electronic, UAVs(unmanned aerial vehicles), mobile phone motherboard and high-difficulty repair components, it can repair special and high-difficulty repair components, including CGA, BGA, QFN, CSP, LGA, Micro SMD, MLF(Micro Lead Frames)

Automatic removal of faulty devices

　Clean pad and add solder (flux or tin  paste)

 Automatic welding, automatic disassembly

Selective temperature curve

Automatic cooling

The integration design of hot air head and mount head can realize automatic welding, automatic disassembly
Up and down hot air, bottom infrared wave heat pipe, three temperature zone independent heating, heating time and temperature real-time display
Color optical vision system, with the functions of light splitting, amplification and fine tuning, using HDMI interface HD display, megapixel HD camera, high-power optical zoom
Embedded industrial control computer, PLC control, real-time temperature curve display, temperature curve analysis can be compared with the historical preservation curve 
Suction nozzle pressure can be adjusted and the minimum pressure is less than 30g, to ensure that BGA does not overflow tin when welding
Built-in vacuum pump, the maximum vacuum suction is up to 80G. Fine tuning suction nozzle, which can achieve 0-60° rotation;
8 segment rising (falling) temperature +8 segment constant temperature control, mass storage of temperature curve, curve analysis on the touch screen