Win-Win Cooperation
Release time:
2018-05-01 01:04
Source:
Win-Win Cooperation
[Cooperation] Shenzhen MicroASM Semiconductor Technology Co., Ltd. successfully delivered a batch of micro assembly equipment with Hangwei General Electric Medical System Co., Ltd.
Challenges
Comprehensive positioning accuracy up to 5 microns.
The system integrates 8 inches and below Wafer feeding
Laser measurement, ultra-high precision mounting, hot pressing bonding
Ultrasonic bonding, visual detection, high precision dispensing, UV curing, hot nitrogen protection and other functions
It can provide a complete set of solutions for complex multiple micro-assembly technology.
solution
Substrate material
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Company Website:http://www.microasm.com
Company Email:sales@microasm.com
Office Headquarters: 13th Floor, Building 4, Xingyuan Advanced Materials Industrial Park, Shutianpu Community, Matian Street, Guangming District, ShenzhenOffice: Yangyong Industrial Zone, Shapu Community, Songgang Street, Bao 'an District, Shenzhen
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