[Cooperation] Shenzhen MicroASM Semiconductor Technology Co., Ltd. successfully delivered a batch of micro assembly equipment with Hangwei General Electric Medical System Co., Ltd.
Comprehensive positioning accuracy up to 5 microns.
The system integrates 8 inches and below Wafer feeding
Laser measurement, ultra-high precision mounting, hot pressing bonding
Ultrasonic bonding, visual detection, high precision dispensing, UV curing, hot nitrogen protection and other functions
It can provide a complete set of solutions for complex multiple micro-assembly technology.