ShenzhenMicroASMSeminconductorTechnologyCo.,LtdrelocatedattheendofNovember2018　　Thecompany'srelocationislocatedinCountryGardenRobotIndustrialParkatthejunctionofShenzhenandDongguan:Building6,CountryGardenPlant,No.2EightRoad,YangyongIndustrialZone,ShapuCommunity,SonggangStreet,Bao'anDistrict.CountryGarden'sfirstroboticsindustrialpark.TheprojectwillinherittheindustrialadvantagesofBao'anCentralDistrict,startingfromtheentireindustrialchainofrobotindustryproductionandresearchanddevelopment,focusingontheintroductionofrobotsandrelatedsupportingindustriestocreateanindustrialparkwiththethemeofrobots.　　GardenCountryGardenLogo　　CompanylocationBuilding6　　Parknavigationmap　6buildings,4thfloor　　Parksupporting:RedKumquatRobotRestaurant　　Parksupportingfacilities:singleapartmentdormitorybuilding园区风景/一、二Parkscenery/Threeorfour

Agoodofficeenvironmentiscrucialtooptimizingperformance.Agoodworkingenvironmentallowsemployeestohavefullworkenthusiasmandcontinuousworkmotivationanddevotethemselvestowork.Itisalsoeasiertoinspireemployees'creativeinspiration;badworkTheenvironmentwilldepressthewilloftheemployees,workabsently,andevenseriouslyaffectthestabilityoftheemployees.Thisisespeciallytrueforthebrain-workercommunity. WhenIwalkedintothemicro-semiconductorcompany,IfeltthatIhadenteredagreenhouse,whichmademefeelhappyeveryday,anofficeworkingenvironmentthatisgoodforphysicalandmentalhealthandimprovedworkefficiency.TodayIwillintroduceourofficeenvironment. 　　Companyfrontdesk　　Onthelefthandsideofthedoor,someplantsareinsight,andthegreenplantsarethebackdrop.　　Honordisplaycabinet　Next,youseeourofficearea.Thesize,format,andcolorofdesks,chairs,cabinets,etc.areasuniformaspossible-itcanenhancetheaestheticeffectoftheoffice,andgreenplantsalsoaddatouchofvitalitytotheworkingenvironment.　Generaloffice　　Largeconferenceroom　　小会议室　Tealounge　　laboratory　Cleanroom　　Productionofficearea　　ReworkStationProductLine　　　　MicroAssemblyProductLine　Productionareacorridor　　MicroAssemblyProductLine　　Productionareacorridor　　Debugarea　　Inspectionarea　　Warehousearea

Theme:PioneeringtheCoreandEnjoyingtheFuturewithIntelligence Time:May8-10,2019 Location:ChongqingInternationalExpoCenter(YuelaiConventionandExhibitionCity)　Scale:20000㎡ 300exhibitors 15,000professionalvisitors Forum:GlobalSemiconductorIndustryDevelopmentInnovationForum Seminarindustryinvestmentandfinancinganalysissummit　　Internet,Automotive,OpticalCommunications,SmartHealthcare,IntelligentTransportationandSemiconductorIndustryDemandDevelopmentForum　positionnumber：A53　　TheGlobalSemiconductorIndustry(Chongqing)ExpowillbeheldinMaythisyear,bringinganindustryeventforprofessionals.  ShenzhenMicroASMSemiconductorTechnologyCo.,Ltd.focusesontheR&D,design,assemblyandsalesofhigh-performancestickyequipment,andfocusesonthedevelopmentofhigh-speed,high-precision,multi-functional,fullyautomaticsemiconductorpackagingequipment.ThemainareasinvolvedareICintegratedcircuitpackaging,MicroLED/MiniLEDpackaging,high-speedopticalmoduleassembly,RFdevice,microwavedevice,MEMSsensorandotherdevicepackaging,andmedicalCTdetectorassembly.High-precisionmotioncontroltechnology,leadingmachinevisiontechnologyandflexiblesoftwarealgorithmsareourcorecompetitiveness.Weareproficientinrichsemiconductorpackagingtechnology,andtheequipmentcanassemblevariousprocessmodules,suchashigh-precisiondispensingmodules,UVlightcuringmodules,eutecticbondingmodules,laserheatingmodules,ultrasonicheatingmodules,frictionweldingmodules,Laserrangingmodule,hotnitrogenprotectionmodule,real-timemonitoringmodule,automaticnozzleswitchingfunctionmodule,Wafer&Trayfeedingmodule,etc.　　Theequipmentsystemcaninterfacewiththeworkshopmanagementsystem,recordtheplacementprocessofeachdeviceinrealtime,andcanchecktheproductionstatusoftheequipmentatanytime.Atthesametime,theplacementcompensationparameterscanbeadjustedaccordingtothedynamicdatatooptimizetheequipmentuse.Wearecommittedtoprovidingcustomerswithaseriesofsemiconductordevicepackagingsolutions,providingcustomerswithbetterproductsandservicesandcontinuouslycreatingnewvalue.Sofar,wehaveestablishedstrategicpartnershipswithindustryleaderssuchasGeneralMedical,InstituteofMicroelectronics,ChineseAcademyofSciences,SecondAcademyofAerospaceScienceandTechnology,ThirdAcademy,BOE,ShennanCircuit,TsinghuaUniversity,SouthernUniversityofScienceandTechnology,NationalUniversityofDefenseTechnology,etc.Relationship,wehaveastrongafter-salesteamthatcanprovidecustomerswithfasterandbetterservicesatanytime.　　Ourcompanysellsthefollowingself-developedcutting-edgeprocessequipment: MicroASMMicroASMAMSFlipBonderApplicationareas:MEMSpackaging,flip-chipbonding,front-chipbonding WaferlevelpackageOpticalmodulepackageSensorpackageMiniLEDplacement MicroASMMicroASMAMXfull-functionstickymachineApplicationareas:MicroLED,miniLEDarraychippatch, Microopticalchip,displaychippackage ·Metric03015,008004devicesonnextgenerationmobilephones ·LargeMedicalEquipment(CoreImagingModuleAssembly) ·Opticaldevices(laserLDpalladiumassembly,VCSEL,PD,LENSassembly,etc.) ·Semiconductors(MEMSdevices,RFdevices,microwavedevicesandhybridcircuits) ·Siliconchip,GaAschip,bulksilicondevice,AlGaInN,etc.   MicroASMMicroASMM-Smanual-semi-automaticmicro-assemblysystem　　TheM-Splatformisamanual-semi-automaticmicro-assemblysystem.Canbematchedwithnozzleheatingmodule,laserheatingmodule,UVdispensingandcuringmodule,hotnitrogenprotectivegasmodule,substratepreheatingmodule,processmonitoringmodule,andflipchipsolderingmodule. Thisseriesofproductshasstableperformance,highcostperformance,andeasyoperation.Itisespeciallysuitableforscientificresearchinstitutesanduniversitylaboratoriesthatdonotrequirehighproductionefficiencyandhighaccuracyrequirements. Applications:MEMSpackaging,flip-chipbonding,front-chipbonding WaferlevelpackageOpticalmodulepackageSensorpackageMiniLEDplacement　　SiliconPhotoelectricModule 　　Sensorassembly　　MedicalModule  　　Microlaser　Hybridcircuitassembly　　The2019GlobalSemiconductorIndustry(Chongqing)Expotakesthethemeof“exploringandcreatingthe“core”andenjoyingthefutureintelligently”,focusingonexpandingintelligentapplicationsandacceleratingthedevelopmentofChongqing'sintelligentindustryanddigitaleconomy.Theplannedexhibitionareais20,000squaremeters,with300well-knowncompaniesparticipating.Globalsemiconductor,integratedcircuit,chipandR&Danddesigncompaniesparticipatedintheexhibition,focusingonthedisplayofnewproductsandtechnologies,inviting15,000professionalvisitorstovisit,andholdingmorethan10technologiessuchastheGlobalSemiconductorIndustryDevelopmentandInnovationForum,theSemiconductorandIntelligentVehicleTechnologyInnovationForum,etc.Forum,tobuildthemostprofessionalupstreamanddownstreamcommunicationandcooperationplatform. ThepreparatoryworkfortheExpohasbeenfullylaunched.Youarenowinvitedtoparticipateinthiseventtosharethefeastofcutting-edgetechnologicalinnovationinthesemiconductorindustry,tofullyshowcasethehigh-endbrandimageofsemiconductorcompanies,sharebusinessopportunitiesandtalkaboutthefuture!

WarmlywelcometheheadofShenzhenBaoanDistricttovisitourcompanyforinspectionandguidance　　MayorofBaoanDistrictvisitedMicroASMSemiconductor　　PresidentWangofMicroelectronicsandothercompanyleadersreceivedavisitfromtheleaderoftheBaoanDistrict　　PresidentWangofMicroASMSemiconductorsexplainedtothegueststhebrandconcept,businessmodelandfutureplansofthecompany.　　Italsoshowedthecompany'smain"semiconductormicro-assemblyequipment"andexplainedthemainfunctionsandproductfeaturesoftheequipment.　　MayorofBaoanDistrictvisited MicroASM Semiconductor　MayorofBaoanDistrictvisited MicroASM Semiconductor　　Shenzhen MicroASM SemiconductorTechnologyCo.,Ltd.focusesontheR&D,design,assemblyandsalesofhigh-performancestickyequipment,andfocusesonthedevelopmentofhigh-speed,high-precision,multi-functional,fullyautomaticsemiconductorpackagingequipment. ThemainfieldsinvolvedareICintegratedcircuitpackaging,MicroLED/MiniLEDpackaging,high-speedopticalmoduleassembly,RFdevice,microwavedevice,MEMSsensorandotherdevicepackaging,andmedicalCTdetectorassembly.Wearecommittedtoprovidingcustomerswithaseriesofsemiconductordevicepackagingsolutions,providingcustomerswithbetterproductsandservicesandcontinuouslycreatingnewvalue. High-precisionmotioncontroltechnology,leadingmachinevisiontechnologyandflexiblesoftwarealgorithmsareourcorecompetitiveness.Weareproficientinrichsemiconductorpackagingtechnology.Theequipmentcanarbitrarilyassemblevariousprocessmodules,suchashigh-precisiondispensingmodules,UVlightfixed-linemodules,eutecticbondingmodules,laserheatingmodules,ultrasonicheatingmodules,andfrictionweldingmodules.,Laserrangingmodule,hotnitrogenprotectionmodule,real-timemonitoringmodule,automaticnozzleswitchingfunctionmodule,Wafer&Trayfeedingmodule,etc.   Typicalapplications:3Dpackaging,KingCirclepackaging,LEDpackaging,microwavecomponents,optoelectronicmodules,RFpoweramplifiers,medicalimaging,infraredsensors,pressuresensors,micro-electro-mechanicaldevices,semiconductorpackaging,hybridcircuits,concentratedsolarpackaging,multi-chipModules,cardiacpacingandhearingaids,laserdiodes,inkjetandprintheads,systemsonchips,systemsinpackages.

InthemorningofMay11th,theairwasrefreshingwithsummerrefreshing.Inthehotsummerseason,boardingthehigh-speedrailforGuilinwasfullofcheersandlaughterfromShenzhentothepoeticandpicturesqueGuilinlandscape.Thelong-awaitedcorporatetourhasfinallybegun.　　Atthistime,thecolleaguesittinginthecarriagehadabrightsmileonhisface,andhismoodwasextremelyrelaxedandhappy.Everyonetakesofftheirworkclothesandputsoncomfortablesportswear,whichismoreyouthful.Alongtheway,everyonewaseatingsnacks,chatting,listeningtomusic,andplayinggames,makingthesethreehoursofjourneylesstired.Atthistime,ourbigfamilyismorehappyandfeelsthateveryoneissokindandcute.　　Groupphoto　　PhotoofR&Ddepartment　　Groupphotoofmaterialdepartment,qualitydepartment,PMCdepartmentandafter-salesservicedepartment　　Groupphotoofproductiondepartment　　ThenextdayIwenttoMalingGuzhaiandlearnedthattheDaiisoneofthefourmajorethnicgroupsinGuangxi.Thisnationhasmanynon-materialcultures,suchasDaisongs,batik,etc.VisittheirhousesandwatchtheSonganddanceoftheDaipeople.Pickoutsomehandmadesilverjewelry.　　Gorgeousandcolorfullightsmakenature'sghost-axeworkersmoredreamy.Slowlyviewalongthetrailsinthecave.Stalactitepillars,stonetowers,stonemantlesandstonewaterfallsofvariousshapesconstitutethedreamofYinziyan.Caveworld.　　LijiangRiverisrafted.TheLijiangRiverisatypicalkarstterrain.ItiscalledLiliRiverandBailiGallery.ThenewversionofthebackpatternofRMB20isasectionofthelandscapeoftheLiRiver.　　TheLiRiverhasavarietyofflavorsindifferentweather,thereflectionofthegreenpeaksonasunnyday,themountainsandcloudsonacloudyday,andtherainandrainarelikedreams.　　Onthethirdday,climbthemountaintoadmiretheLongjiterracescoveringanareaof70.1squarekilometers.ItwasbuiltintheYuanDynastyandformedintheMingDynasty. Thankyouforyourcompany'scare,letusrecognizeadifferentlandscapeofGuilinduringthisthree-daytour,likethecivilizationanddevelopmentofGuilin,andthefoodandlifeofGuilin.

OnJuly13,2019,wemetatPhoenixMountain~Hiking:Challengeyourselfandfeelnature　　Inessence,trekkingisnotasport,butakindofpractice.Thepurposeisnot"bitterness",not"exercise",but"cultivation."　　Feelinghikingontheheart,wecanfindthat,infact,aperson'slifeislikeahikingtrip,therearejoy,pain,persistence,andhesitation;lifeislikethesceneryalltheway,comeonandpassyoubyIfyoulearntousethecamerainyourhand,whatstaysonthephotosensitivefilmisyourwealth;walkingandlifeareactuallynodifferent,theyallneedtobeattentive,theyneedperseverance,andtheyhaveastartingpointandanendingpoint.

GatheringinnovationpowerandintegratingtheentirephotovoltaicindustrychainThe21stChinaInternationalOptoelectronicExposition(CIOE)Willbe September4-7,2019atShenzhenConventionandExhibitionCenter Hold。　　ShenzhenMicroASMSemiconductorTechnologyCo.,Ltd.willbringonlinefull-automaticbondingmachineAM-X,offlinefull-automaticsemiconductorstickingmachineAM-S,offlinesemi-automaticmicro-assemblybondingmachineM-5,offlinemanualmicro-assemblyThesystemM-10Sseriesequipmentisgrandlyexhibitedintheexhibitionarea:LaserTechnologyandIntelligentManufacturingExhibitionHall22Q112Q12,sincerelyinvitecolleaguesintheindustrytovisit,exchangeandbusinessnegotiations.　　Exhibits　　——————　　Boothnumber2Q112Q12 Onlineautomaticmicro-groupsystem　TheAM-Xplatformisacompletemicro-assemblysystem.Itscoremoduleintegratesthreeparts:high-precisionplacementsystem,pre-fixationsystemandproductiondataanalysis.Themicro-levelgantrydoubledrivestructurecanbeusedtoformanonlinegenerationsystem. Canbeequippedwithnozzleheatingmodule,tray/waferplacingtray,ultrasonicmodule,laserheatingmodule,UVdispensingandcuringmodule,hotnitrogenandformicacidprocessprotectivegasmodule,basiclow-heatingmodule,processmonitoringmodule,chippourInstalltheweldingmodule. Electronicdevices(MicroLED,miniLEDdisplaychips,metric03015,008004devicesonnext-generationmobilephones),largemedicaldevices(coreimagingmoduleassembly),opticaldevices(laserLDpalladiumassembly,VCSEL,PD,LENS,etc.),Semiconductors(MEMSdevices,RFdevices,microwavedevicesandhybridcircuits)andotherfieldsarewidelyused.　　TheAM-Xsystemwillrecordtheplacementdataofeachproductinrealtime,andcanfreelyandflexiblyquerytheproductionstatus,andatthesametimeadjusttheplacementcompensationdataaccordingtothedynamicdatatoachievethebestproductionstatus. Applicationareas: MicroLED,miniLEDarraychippatch Microopticalchip,displaychippackage 的Metric03015,008004devicesonnext-generationphones Largemedicalequipment(coreimagingmoduleassembly) Kryptonoptics(laserLDpalladiumassembly,VCSEL,PD,LENSassembly,etc.) Semiconductors(MEMSdevices,RFdevices,microwavedevicesandhybridcircuits) Siliconchip,GaAschip,bulksilicondevice,AlGaInN,etc.　　Offlinefull-automaticmicro-groupsystem　　TheAM-Splatformisanofflinefullyautomaticmicro-assemblysystemdevelopedbythecompany,whichcanbeequippedwithanozzleheatingmodule,atray/waferplacingtray,anultrasonicmodule,alaserheatingmodule,aUVdispensingandcuringmodule,hotnitrogenandformicacidprocessesProtectivegasmodule,substratepreheatingmodule,processmonitoringmodule,chipflip-chipsolderingmodule.　　Theplatformadoptsamarblebridgestructure,anditscoremotion-relatedcomponentsadopttheIsraelimilitarybrandELMOdrivesystemandtheDutchtoplineardrivemotorTECNOTION,whichcanachieve0.1μresolutionand0.5μrepetitivepositioningaccuracyonasingleaxis.　　Thesoftwaresystemdevelopedbythecompanyintegratesfunctionalmodulessuchasinternalconstanttemperaturecontrol,placementaccuracyself-tuning,andplacementdataanalysis.Wecancustomizetheprocessflow,software,andmodulesfordifferentcustomerneeds,maximizingthein-depthcombinationofequipmentapplicationsandcustomeractualprocess.　　Applicationarea：　　MEMSpackaging           Flip-chipbonding　　Chipbonding           Waferlevelpackaging　　Opticalmodulepackage        Sensorpackage　　MiniLEDMount 　　Off-linesemi-automaticmicro-groupsystem　　TheMplatformisanofflinesemi-automaticmicro-assemblysystem.Basedonthisplatform,threemodelswithdifferentpositioningaccuracyofM5/M10/M20havebeendeveloped.Withnozzleheatingmodule,laserheatingmodule,UVdispensingandcuringmodule,hotnitrogenshieldinggasmodule,substratepreheatingmodule,processmonitoringmodule,chipflip-chipweldingmodule　　Withthelaserweldingmodule,itcancompletetherepairofminiLEDflexiblecircuitboards,largemedicalequipment(coreimagingmoduleassembly),opticaldevices(laserLDpalladiumassembly,VCSEL,PD,LENSassembly,etc.),semiconductors(MEMSdevices,RFdevices,microwaves)Devicesandhybridcircuits).　　Thisseriesofproductshasstableperformance,highcostperformance,andconvenientoperation.Itisespeciallysuitableforscientificresearchinstitutesanduniversitylaboratoriesthatdonotrequirehighproductionefficiencyandhighprecision.　　Applicationarea：　　MEMSpackaging          Flip-chipbonding　　Chipbonding           MiniLEDMount　　Opticalmodulepackage       Sensorpackage　　Laserdiodelaserbarwelding 　　        MicroASMM-Smanual-semi-automaticmicro-assemblysystem　　TheM-Splatformisamanual-semi-automaticmicro-assemblysystem.Canbematchedwithnozzleheatingmodule,laserheatingmodule,UVdispensingandcuringmodule,hotnitrogenprotectivegasmodule,substratepreheatingmodule,processmonitoringmodule,andflipchipsolderingmodule. Thisseriesofproductshasstableperformance,highcostperformance,andeasyoperation.Itisespeciallysuitableforscientificresearchinstitutesanduniversitylaboratoriesthatdonotrequirehighproductionefficiencyandhighaccuracyrequirements. Applications:MEMSpackaging,flip-chipbonding,front-chipbonding WaferlevelpackageOpticalmodulepackageSensorpackageMiniLEDplacement　　AboutMicroASMSemiconductor 　　Boothnumber2Q112Q12　　ShenzhenMicroASMSemiconductorTechnologyC

AboutUs　　ShenzhenMicroASMSemiconductorTechnologyCo.,Ltd.focusesontheR&D,design,assemblyandsalesofhigh-performancestickyequipment,andfocusesonthedevelopmentofhigh-speed,high-precision,multi-functional,fullyautomaticsemiconductorpackagingequipment.ThemainfieldsinvolvedareICintegratedcircuitpackaging,MLED/MiniLEDpackaging,high-speedopticalmoduleassembly,RFdevice,microwavedevice,MEMSsensorandotherdevicepackaging,andmedicalCTdetectorassembly.High-precisionmotioncontroltechnology,leadingmachinevisiontechnologyandflexiblesoftwarealgorithmsareourcorecompetitiveness.Weareproficientinrichsemiconductorpackagingtechnology,andtheequipmentcanassemblevariousprocessmodules,suchashigh-precisiondispensingmodules,UVlightcuringmodules,eutecticbondingmodules,laserheatingmodules,ultrasonicheatingmodules,frictionweldingmodules,Laserrangingmodule,hotnitrogenprotectionmodule,real-timemonitoringmodule,automaticnozzleswitchingfunctionmodule,Wafer&Trayfeedingmodule,etc.Theequipmentsystemcaninterfacewiththeworkshopmanagementsystem,recordtheplacementprocessofeachdeviceinrealtime,andcanchecktheproductionstatusoftheequipmentatanytime.Atthesametime,theplacementcompensationparameterscanbeadjustedaccordingtothedynamicdatatooptimizetheequipmentuse.Wearecommittedtoprovidingcustomerswithaseriesofsemiconductordevicepackagingsolutions,providingcustomerswithbetterproductsandservicesandcontinuouslycreatingnewvalue.Sofar,wehaveestablishedstrategicpartnershipswithindustryleaderssuchasGeneralMedical,InstituteofMicroelectronics,ChineseAcademyofSciences,SecondAcademyofAerospaceScienceandTechnology,ThirdAcademy,BOE,ShennanCircuit,TsinghuaUniversity,SouthernUniversityofScienceandTechnology,NationalUniversityofDefenseTechnology,etc.Relationship,wehaveastrongafter-salesteamthatcanprovidecustomerswithfasterandbetterservicesatanytime.　　Ourcompanysellsthefollowingself-developedcutting-edgeprocessequipment: MicroASMMicroASMAMSFlipBonder　Applicationareas:MEMSpackaging,flip-chipbonding,front-chipbonding WaferlevelpackageOpticalmodulepackageSensorpackageMiniLEDplacement 　　MicroASMAMXfull-functionstickymachine　　Applicationareas:MicroLED,miniLEDarraychippatch, Microopticalchip,displaychippackage ·Metric03015,008004devicesonnextgenerationmobilephones ·LargeMedicalEquipment(CoreImagingModuleAssembly) ·Opticaldevices(laserLDpalladiumassembly,VCSEL,PD,LENSassembly,etc.) ·Semiconductors(MEMSdevices,RFdevices,microwavedevicesandhybridcircuits) ·Siliconchip,GaAschip,bulksilicondevice,AlGaInN,etc. 　　MicroASMM-Smanual-semi-automaticmicro-assemblysystem　　TheM-Splatformisamanual-semi-automaticmicro-assemblysystem.Canbematchedwithnozzleheatingmodule,laserheatingmodule,UVdispensingandcuringmodule,hotnitrogenprotectivegasmodule,substratepreheatingmodule,processmonitoringmodule,andflipchipsolderingmodule. Thisseriesofproductshasstableperformance,highcostperformance,andeasyoperation.Itisespeciallysuitableforscientificresearchinstitutesanduniversitylaboratoriesthatdonotrequirehighproductionefficiencyandhighaccuracyrequirements. Applications:MEMSpackaging,flip-chipbonding,front-chipbonding   WaferlevelpackageOpticalmodulepackageSensorpackageMiniLEDplacement

ShenzhenMicroASMSemiconductorTechnologyCo.,Ltd.regularlyinformscustomersandinterestedcompaniesaboutthestatusandtrendsofhigh-endchipandreworktechnologydevelopmentthroughnewsletters,technologyexchangeactivities,andexhibitions.   Thankyouforvisitingourboothatthisyear'sshow.   Pleaseseetheupcomingexhibitionsbelow.　　The20thChinaInternationalOptoelectronicExposition(CIOE2018)　　Exhibitiontime:September5-8,2018   Exhibitionlocation:ShenzhenConventionandExhibitionCenter   BoothNo.:3D02