Flip chips require the front (active side) of the Chip to be turned upside down for assembly and bonding to the carrier plate. Then it uses the flip chip bonded process. First of all, the Chip is processed as a Flip Chip form. Connection points should be arranged on the surface of the chip to connect the chip I/O circuit to the packing and loading board. This connection is called wafer bumps (bump) FC inversion technology which mainly includes fusion welding, bonding, adhesive connection and changed hands module. The equipment can be compatible with the above function at present.