OUR PRODUCTS
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MicroASM AMX full-function sticky machine
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MicroASM AMS Flip Bonder
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Micro group MicroASM M micro assembly bonding machine
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MicroASM M-10S Micro Assembly Bonding Machine
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AM series Mini LED full-automatic laser repair equipment
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Effective ShuttleStar SV-2000A
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Effective ShuttleStar RW-E6250U
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Effective ShuttleStar RW-SV560A
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Effective ShuttleStar RW-SV550

MicroASM AMX full-function Die-Bonder
It can be equipped with nozzle heating module, material plate/wafer placing plate, ultrasonic module, laser heating module, UV dispensing and curing module, hot nitrogen and formic acid process protection gas module, base preheating module, process monitoring module, chip flip welding module.

MicroASM AMS invert bonding machine

AM series Mini LED full-automatic laser repair equipment
AM-X platform is a complete micro-assembly system. Its core module integrates three parts: high-precision mount system, prefix system and production data analysis. The double drive structure of micron gantry can be used to construct the online generating system.

MicroASM M micro assembly bonding machine

MicroASM M-10S micro-assembly bonding machine

ShuttleStar SV-2000A large repair platform

ShuttleStar RW-E6250U large repair platform
It adopts embedded industrial control computer, which can achieve PLC control and show temperature curve, real-time display, temperature curve analysis. And it can be compared with the historical preservation curve. In the process of heating, the curve analysis, setting and correction of process parameters can be carried out. With the functions of light splitting, amplification and fine adjustment, including color difference resolution device, auto focus and software operation, it can be operated by rocker. Upper and lower hot air heads can be moved at any position in the large IR bottom preheating zone, which is suitable for BGA to be repaired reliably at different positions on PCB.

ShuttleStar RW - SV560A

ShuttleStar RW-SV550 medium - sized repair platform
Products
MicroASM AMX full-function sticky machine
MicroASM AMS Flip Bonder
Micro group MicroASM M micro assembly bonding machine
MicroASM M-10S Micro Assembly Bonding Machine
AM series Mini LED full-automatic laser repair equipment
Effective ShuttleStar SV-2000A
Effective ShuttleStar RW-E6250U
Effective ShuttleStar RW-SV560A
Effective ShuttleStar RW-SV550
Contact
Company email:sales@microasm.com
Office Headquarters: 401, Building 6, Country Garden Plant, No. 2 Eighth Road, Yangyong Industrial Zone, Shapu Community, Songgang Street, Bao'an District, Shenzhen
Office: Yangyong Industrial Zone, Shapu Community, Songgang Street, Baoan District, Shenzhen

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