Adhesive technology
Release time:
2020-01-03 11:09
Source:
Adhesive technology
Glue in semiconductor packaging plays an indispensable role like concrete in the construction of high-rise buildings, such as chip fixation (red glue fixation chip), electrical connection (silver paste fixation semiconductor chip), stress reduction (silica gel fixation MEMS device), device protection (COB encapsulation chip) and so on. Glue plays an important role in packaging, and there are many ways of dispensing, common dispensing methods include the following four:
Dispensing mode |
advantages |
disadvantages |
note |
Time -pressure needle dispensing |
Simple structure, low maintenance cost |
Low accuracy, affected by liquid level |
、 |
Screw valve |
High accuracy, suitable for high viscosity and packing liquid
|
Screw cleaning is not convenient, the fluid is greatly affected by the ambient temperature |
Suitable for solvent;Solder paste, particulate material;Hot melt grease;Silver paste etc. |
Piston pump |
Not affected by fluid viscosity changes
|
Cleaning is difficult, not suitable for packing fluid |
Suitable for dot, not for marking |
Spray Dispensing |
High speed, high precision , no contact, no damage device, no z axis motion |
High cost, difficult cleaning, not suitable for large particle packing fluid |
Drive the firing needle to move at high speed through high speed solenoid valve, and spray a fixed number of glue points in unit time |
solution
type of glue |
application |
Dispensing mode |
Quick-drying glue |
Mobile phone button, circuit temporary bonding |
Needle, rubber valve |
Uv glue |
Touch screen, LCD circuit protection, buttons, headset, CCD, CCM lens |
Spray, time - pressure rubber valve |
Bottom Fill COB |
SMT,BGA |
Spray, screw valve, needle barrel |
Conductive adhesive, solder paste
|
SMT,LCD,LED |
Screw valve, needle barrel |
Three proofing glue |
Flexible plate, waterproof case |
The spray valve |
Two component acrylic acid, two component epoxy |
Housing bond, seal, connector bond |
Two component rubber valve |
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