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2019 Global Semiconductor Industry (Chongqing) Expo

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Seminar industry investment and financing analysis summit Internet, Automotive, Optical Communications, Smart Healthcare, Intelligent Transportation and Semiconductor Industry Demand Development Forum

Theme: Pioneering the Core and Enjoying the Future with Intelligence

Time: May 8-10, 2019

Location: Chongqing International Expo Center (Yuelai Convention and Exhibition City)

　Scale: 20000㎡

300 exhibitors

15,000 professional visitors

Forum: Global Semiconductor Industry Development Innovation Forum

Seminar industry investment and financing analysis summit

　　Internet, Automotive, Optical Communications, Smart Healthcare, Intelligent Transportation and Semiconductor Industry Demand Development Forum

　position number：A53

　　The Global Semiconductor Industry (Chongqing) Expo will be held in May this year, bringing an industry event for professionals.

Shenzhen MicroASM Semiconductor Technology Co., Ltd. focuses on the R & D, design, assembly and sales of high-performance sticky equipment, and focuses on the development of high-speed, high-precision, multi-functional, fully automatic semiconductor packaging equipment. The main areas involved are IC integrated circuit packaging, Micro LED / Mini LED packaging, high-speed optical module assembly, RF device, microwave device, MEMS sensor and other device packaging, and medical CT detector assembly. High-precision motion control technology, leading machine vision technology and flexible software algorithms are our core competitiveness. We are proficient in rich semiconductor packaging technology, and the equipment can assemble various process modules, such as high-precision dispensing modules, UV light curing modules, eutectic bonding modules, laser heating modules, ultrasonic heating modules, friction welding modules, Laser ranging module, hot nitrogen protection module, real-time monitoring module, automatic nozzle switching function module, Wafer & Tray feeding module, etc.

　　The equipment system can interface with the workshop management system, record the placement process of each device in real time, and can check the production status of the equipment at any time. At the same time, the placement compensation parameters can be adjusted according to the dynamic data to optimize the equipment use. We are committed to providing customers with a series of semiconductor device packaging solutions, providing customers with better products and services and continuously creating new value. So far, we have established strategic partnerships with industry leaders such as General Medical, Institute of Microelectronics, Chinese Academy of Sciences, Second Academy of Aerospace Science and Technology, Third Academy, BOE, Shennan Circuit, Tsinghua University, Southern University of Science and Technology, National University of Defense Technology, etc. Relationship, we have a strong after-sales team that can provide customers with faster and better services at any time.

　　Our company sells the following self-developed cutting-edge process equipment:

MicroASM MicroASM AMS Flip Bonder

Application areas: MEMS packaging, flip-chip bonding, front-chip bonding

Wafer level package Optical module package Sensor package Mini LED placement

MicroASM MicroASM AMX full-function sticky machine

Application areas: Micro LED, miniLED array chip patch,

Micro optical chip, display chip package

· Metric 03015, 008004 devices on next generation mobile phones

· Large Medical Equipment (Core Imaging Module Assembly)

· Optical devices (laser LD palladium assembly, VCSEL, PD, LENS assembly, etc.)

· Semiconductors (MEMS devices, RF devices, microwave devices and hybrid circuits)

· Silicon chip, GaAs chip, bulk silicon device, AlGaInN, etc.

MicroASM MicroASM M-S manual-semi-automatic micro-assembly system

　　The M-S platform is a manual-semi-automatic micro-assembly system. Can be matched with nozzle heating module, laser heating module, UV dispensing and curing module, hot nitrogen protective gas module, substrate preheating module, process monitoring module, and flip chip soldering module.

This series of products has stable performance, high cost performance, and easy operation. It is especially suitable for scientific research institutes and university laboratories that do not require high production efficiency and high accuracy requirements.

Applications: MEMS packaging, flip-chip bonding, front-chip bonding

Wafer level package Optical module package Sensor package Mini LED placement

　　Silicon Photoelectric Module

　　Sensor assembly

　　Medical Module

　　Micro laser

　Hybrid circuit assembly

　　The 2019 Global Semiconductor Industry (Chongqing) Expo takes the theme of “exploring and creating the“ core ”and enjoying the future intelligently”, focusing on expanding intelligent applications and accelerating the development of Chongqing's intelligent industry and digital economy. The planned exhibition area is 20,000 square meters, with 300 well-known companies participating. Global semiconductor, integrated circuit, chip and R & D and design companies participated in the exhibition, focusing on the display of new products and technologies, inviting 15,000 professional visitors to visit, and holding more than 10 technologies such as the Global Semiconductor Industry Development and Innovation Forum, the Semiconductor and Intelligent Vehicle Technology Innovation Forum, etc. Forum, to build the most professional upstream and downstream communication and cooperation platform.

The preparatory work for the Expo has been fully launched. You are now invited to participate in this event to share the feast of cutting-edge technological innovation in the semiconductor industry, to fully showcase the high-end brand image of semiconductor companies, share business opportunities and talk about the future!

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MicroASM Semiconductor Moved To New Production Park Style

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MicroASM Semiconductor Moved To New Production Park Style

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