imgimgimg

这是描述信息
Products

OUR PRODUCTS

Your present location:
Home
>
>
MicroASM M-10S Micro Assembly Bonding Machine
产品名称

MicroASM M-10S micro-assembly bonding machine

The M-s platform is a manual - semi-automatic micro-assembly system. Based on this platform, three models of M5S/M10S/M20S with different positioning accuracy were developed. Equipped with nozzle heating module, laser heating module, UV dispensing and curing module, hot nitrogen protection gas module, base preheating module, process monitoring module, chip flip welding module.
Previous
1

Contact

URL:http://www.microasm.com

Company email:sales@microasm.com
Office  Headquarters: 401, Building 6, Country Garden Plant, No. 2 Eighth Road, Yangyong Industrial Zone, Shapu Community, Songgang Street, Bao'an District, Shenzhen

Office: Yangyong Industrial Zone, Shapu Community, Songgang Street, Baoan District, Shenzhen

搜索
确认
取消
img

Website QR code

 Copyright  © 2020 Shenzhen MicroASM Seminconductor Technology Co.,Ltd  All rights reserved      粤ICP备18019383号       300.cn

Contact