OUR PRODUCTS
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MicroASM AMX full-function sticky machine
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MicroASM AMS Flip Bonder
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Micro group MicroASM M micro assembly bonding machine
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MicroASM M-10S Micro Assembly Bonding Machine
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AM series Mini LED full-automatic laser repair equipment
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Effective ShuttleStar SV-2000A
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Effective ShuttleStar RW-E6250U
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Effective ShuttleStar RW-SV560A
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Effective ShuttleStar RW-SV550

ShuttleStar RW-E6250U large repair platform
It adopts embedded industrial control computer, which can achieve PLC control and show temperature curve, real-time display, temperature curve analysis. And it can be compared with the historical preservation curve. In the process of heating, the curve analysis, setting and correction of process parameters can be carried out. With the functions of light splitting, amplification and fine adjustment, including color difference resolution device, auto focus and software operation, it can be operated by rocker. Upper and lower hot air heads can be moved at any position in the large IR bottom preheating zone, which is suitable for BGA to be repaired reliably at different positions on PCB.
Products
MicroASM AMX full-function sticky machine
MicroASM AMS Flip Bonder
Micro group MicroASM M micro assembly bonding machine
MicroASM M-10S Micro Assembly Bonding Machine
AM series Mini LED full-automatic laser repair equipment
Effective ShuttleStar SV-2000A
Effective ShuttleStar RW-E6250U
Effective ShuttleStar RW-SV560A
Effective ShuttleStar RW-SV550
Contact
Company email:sales@microasm.com
Office Headquarters: 401, Building 6, Country Garden Plant, No. 2 Eighth Road, Yangyong Industrial Zone, Shapu Community, Songgang Street, Bao'an District, Shenzhen
Office: Yangyong Industrial Zone, Shapu Community, Songgang Street, Baoan District, Shenzhen

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