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MicroASM M-10S micro-assembly bonding machine
Classification:
- DESCRIPTION
- key Parameter
- Application Area
- Related Processes
- Product Advantages
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The M-s platform is a manual - semi-automatic micro-assembly system. Based on this platform, three models of M5S/M10S/M20S with different positioning accuracy were developed. Equipped with nozzle heating module, laser heating module, UV dispensing and curing module, hot nitrogen protection gas module, base preheating module, process monitoring module, chip flip welding module.
With the laser welding module, mini LED flexible circuit board can be repaired, large medical equipment (core imaging module assembly), optical devices (LD PD bar assembly, VCSEL, PD, LENS assembly, etc.), semiconductor (MEMS devices, Rf devices, microwave devices and hybrid circuits).
This series of products have stable performance, high cost performance and convenient operation, especially suitable for scientific research institutes and academic laboratories that require low production efficiency and high precision.
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type
M-10S
Process monitoring system (optional)
It can measure length and area
Way to work
Desktop manual - semi-automatic
Pick up tool head (clamping type)
customized
The scope of work
15*80mm
Suction nozzle
customized
Mount device size range
0.03~20mm
Process protection gas (optional)
Hot nitrogen
Comprehensive mounting accuracy
±5μm3sigma
Dispensing system (optional)
Musashi dispensing system is compatible with UV dispensing, epoxy dispensing and silver dispensing
XY driven form
Stepper motor + ball screw
Curing system (optional)
UV curing/heat curing
T axis stroke
±10°
Height measurement (optional)
KEYENCE laser measures 0.005 mm
XY axis resolution
1μm
Laser hot pressing bonding system (optional)
Microasm25-1000°
Z axis resolution
1μm
Ultrasonic hot pressing bonding system (optional)
Microasm25-500°
T axis resolution
manual
Access requirements
220V power 10A0.5Mpa compressed air
Bonding force control
20-1000g
Overall dimensions
Length X width X height ：500X400X650mm
lighting system
White/yellow ring light source
Weight
30kg
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MEMS encapsulation
Flip chip bonding
Formal chip bonding
Laser diode laser bar welding
Optical module package
Sensor package
The Mini LED mount
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Laser heating
Adhesive technology
Curing (uv, temperature)
Eutectic welding gold tin and indium
Laser bar packaging
Hot pressing
Wafer level high precision adhesive
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Manual - semi-automatic operation, easy to operate and cost-effective
High repeatability and application flexibility
Customized function modules and development process according to customer needs
Real-time observation and feedback greatly reduce process development time
Rapid realization of the research and development process to the production process to ensure reliable results
Man-machine friendly interface is easy to operate and easy to program
Can control all process related parameters: pressure, temperature, time, power, light source and image, process environment, etc.
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Company Website:http://www.microasm.com
Company Email:sales@microasm.com
Office Headquarters: 13th Floor, Building 4, Xingyuan Advanced Materials Industrial Park, Shutianpu Community, Matian Street, Guangming District, ShenzhenOffice: Yangyong Industrial Zone, Shapu Community, Songgang Street, Bao 'an District, Shenzhen
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