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ShuttleStar RW-E6250U large repair platform
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ShuttleStar RW-E6250U large repair platform
RW-E6250U adopts the integration design of hot air head and mounting head, which have the function of automatic material absorption, automatic welding, automatic disassembly and automatic discharging (patent no. : ZL200720127185.8);
It adopts embedded industrial control computer, which can achieve PLC control and show temperature curve, real-time display, temperature curve analysis. And it can be compared with the historical preservation curve. In the process of heating, the curve analysis, setting and correction of process parameters can be carried out. With the functions of light splitting, amplification and fine adjustment, including color difference resolution device, auto focus and software operation, it can be operated by rocker. Upper and lower hot air heads can be moved at any position in the large IR bottom preheating zone, which is suitable for BGA to be repaired reliably at different positions on PCB. The lower heating area adopts the infrared hot air mixing heating method and reserves the nitrogen interface, which can complete the repair process of BGA under the protection of nitrogen, and has the saving function of nitrogen, which can save more cost while ensuring the reliable repair quality (patent no. :ZL200920001515.8).
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PCB size W20*D20 ~ W600*D550 mm
The processing range W600*550 mm
PCB thickness 0.5 ~ 4mm
Suitable chip 1*1 ~ 80*80mm
Mounting accuracy ±0.05mm
Minimum spacing 0.15mm
Degree of automation Intelligent full-automatic
Visual alignment system High definition
Heating zone three temperature zones
Temperature curve upper and lower eight temperature zones
Temperature measurement channel Five
Interface The human-machine interface is displayed both in English and Chinese
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Industrial computer, set-top box, vehicle-mounted electronic, UAVs(unmanned aerial vehicles), mobile phone motherboard and high-difficulty repair components, it can repair special and high-difficulty repair components, including CGA, BGA, QFN, CSP, LGA, Micro SMD, MLF(Micro Lead Frames)
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Automatic removal of faulty devices
Clean pad and add solder (flux or tin paste)
Automatic suction, automatic alignment, automatic mounting
Selective temperature curve
Automatic welding, automatic cooling
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It adopts the integration design of hot air head and mounting head, which have the function of automatic material absorption, automatic welding, automatic welding and automatic discharging (patent no. : ZL200720127185.8);
Top and lower hot air, bottom infrared wave heat pipe, three temperature zone independent heating, heating time and temperature real-time display
Color optical vision system, with the functions of light splitting, amplification and fine tuning, using HDMI interface HD display, megapixel HD camera, high-power optical zoom
Embedded industrial control computer, PLC control, real-time temperature curve display, temperature curve analysis can be compared with the historical preservation curve
Suction nozzle pressure can be adjusted, the minimum pressure is less than 30g, to ensure that BGA does not overflow tin when welding
Built-in vacuum pump, the maximum vacuum suction up to 80G, fine tuning suction nozzle, 0-60° rotation
8-segment temperature rise (fall) + 8-segment constant temperature control, mass storage of temperature curve, curve analysis can be carried out on the touch screen
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Company Website:http://www.microasm.com
Company Email:sales@microasm.com
Office Headquarters: 13th Floor, Building 4, Xingyuan Advanced Materials Industrial Park, Shutianpu Community, Matian Street, Guangming District, ShenzhenOffice: Yangyong Industrial Zone, Shapu Community, Songgang Street, Bao 'an District, Shenzhen
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