Application Case
Mobile Phone Micro-Assembly

Mobile Phone Micro-Assembly

2020-01-03

With the high-function development of small portable devices, the number of components installed in electronic devices is increasing, and the demand for small components that occupy a small board area is also increasing. About 400-500 of them are equipped in the latest smart phones. Therefore, new challenges are presented to mount and rework 008004 devices.

RF Micro-Assembly

RF Micro-Assembly

2020-01-03

Radio Frequency (RF) is the abbreviation of Radio Frequency, which means the electromagnetic frequency that can radiate to space. The Frequency range is from 300KHz to 300GHz.RF RF is radio frequency current, which is a kind of high frequency alternating current change electromagnetic wave abbreviation. Rf technology is widely used in the field of wireless communication as one of the micro-assembly applications.

Adhesive technology

Adhesive technology

2020-01-03

Glue in semiconductor packaging plays an indispensable role like concrete in the construction of high-rise buildings, such as chip fixation (red glue fixation chip), electrical connection (silver paste fixation semiconductor chip), stress reduction (silica gel fixation MEMS device), device protection (COB encapsulation chip) and so on. Glue plays an important role in packaging, and there are many ways of dispensing, common dispensing methods include the following four:

Medical Equipment And Module Micro-Assembly

Medical Equipment And Module Micro-Assembly

2020-01-03

CT(Computed Tomography), electronic Computed Tomography. It is the use of accurate alignment of the X ray, gamma ray, ultrasonic, and other sensitive detectors around a certain part of the human body one after another section scan, with fast scanning time, clear image. It can be used for a variety of diseases.

Eutectic Welding Module

Eutectic Welding Module

2020-01-03

The eutectic welding platform can be programmed to meet the requirements of eutectic process and heating rate, so as to optimize the welding effect of the device. At the same time of eutectic welding, the amplitude, frequency and direction of ultrasonic friction welding can be controlled in real time. The eutectic welding platform is surrounded by pre-heated nitrogen or formic acid environment, which can prevent the oxidation of solder caused by high temperature during the welding process from affecting the welding effect.

The WAFER automatic feeding system

The WAFER automatic feeding system

2020-01-03

SIP module is a current trend of semiconductor packaging, which is to integrate one or more IC chips and discrete into one package. This IC chip may be Wire bonding chip or the chip of Flip chip to be mounted on Leadfream, Substrate or LTCC Substrate.

Nozzle automatic switch module

Nozzle automatic switch module

2020-01-03

When micro assembly equipment is running, the suction nozzle is installed in the suction nozzle stem bottom. Through the suction nozzle absorbing components, through the image recognition system after suction nozzle down will conform to the requirements of the component placement on the substrate or other artifacts. When attaching components of different specifications to micro-assembly equipment, the suction nozzle needs to be changed frequently by manual disassembly and installation of a single suction nozzle and adjustment of parameters such as parallelization. This method is time-consuming and inefficient, so it is necessary to make improvements. The device supports 10 nozzle switches at present.

Laser Heating Module

Laser Heating Module

2020-01-03

Laser heating is a heating way which first to make the workpiece surface to produce a certain amount of induced current, quickly heating the surface of the parts and then quickly cooling. Main features of laser heating are as follow:

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