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AM series Mini LED full-automatic laser repair equipment
Classification:
- DESCRIPTION
- key Parameter
- Application Area
- Related Processes
- Product Advantages
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Micro ASM AM series Mini LED full-automatic laser repair equipment
AM-X platform is a complete micro-assembly system. Its core module integrates three parts: high-precision mount system, prefix system and production data analysis. The double drive structure of micron gantry can be used to construct the online generating system.
It can be equipped with nozzle heating module, material plate/wafer placing plate, ultrasonic module, laser heating module, UV dispensing and curing module, hot nitrogen and formic acid process protection gas module, base preheating module, process monitoring module, chip flip welding module.
It is widely used in electronic equipment (Micro LED,mini LED display chip, metric 03015, 008004 on the next generation mobile phone), medical equipment (CT imaging module assembly), optical devices (Laser LD PD bar assembly, VCSEL, PD, LENS assembly, etc.), semiconductor (MEMS devices, Rf devices, microwave devices and hybrid circuits) and other fields.
The AM-X system will record the mount data of each product in real time, so that the production status can be inquired freely and flexibly, and the mount compensation data can be adjusted according to the dynamic data to achieve the best production status.
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Series
AM-10MR
AM-20MR
Equipment automation
Automatic disassembly/automatic welding/dip/pick up chip
Stick putprecision
±5μm 3sigma
±10μm 3sigma
Dip function module
Tin paste/flux
Working mode
Online automatic
Online automatic
UPH
60 seconds / 1
The scope of work
500*400mm
1500*800mm
Application
Mini LED display /Mini LED backlight
Mount device size range
0.05-0.5mm
0.05-0.5mm
Height measurement
KEYENCE laser measures 0.005 mm
Comprehensive mounting accuracy
±5μm 3sigma
±10μm 3sigma
Laser heated nozzle
Size range: inner diameter 0.03-0.2mm, maximum temperature 450℃
XY driven form
Linear motor
Linear motor
Light source
Programmable LED light source, with efficient and reliable background light function
Displacement
distance
X:400mm Y:900mm
X:1600mm Y:900mm
Process monitoring system
Can be record
Z:80mm T:360°
Z:80mm T:360°
Toolhead (suction nozzle)
Vacuum adsorption type
XY axis resolution
±1μ
±2μ
Wafertable
6寸*4个
Z axis resolution
0.5μ
1μ
Carrier/substrate and enclosure are fixed
Vacuum adsorption/mechanical clamping
T axis resolution
0.018°
0.0032°
Process protection gas
Hot nitrogen
Bonding force control
10-400g
10-400g
Access requirements
220V 50±10Hz 3.5KW 0.4. ~ 0.6Mpa compressed air
Upper visual system
1μ
2μ
Dimensions and weight
1300X1700X1850mm、2000kg
Lower visual system
1μ
2μ
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Micro LED, mini LED display chip
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Laser heating
Adhesive technology
Curing (uv, temperature)
Reflow welding \ eutectic, tin gold, indium
Mems assembly
Hot pressing
Ultrasonic welding heat
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Online automatic operation, high production efficiency
Integration of high precision mount system, prefix system and production data analysis system
Record the mounting data of each product and inquire the production status in real time
Man-machine friendly interface is easy to operate and easy to program
Machine intelligence controls all process related parameters: pressure, temperature, time, power, light source and image, and process environment
According to the needs of the free collocation of relevant functional modules: laser heating module, suction nozzle heating module, UV dispensing and curing module
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Contact Us
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Company Website:http://www.microasm.com
Company Email:sales@microasm.com
Office Headquarters: 13th Floor, Building 4, Xingyuan Advanced Materials Industrial Park, Shutianpu Community, Matian Street, Guangming District, ShenzhenOffice: Yangyong Industrial Zone, Shapu Community, Songgang Street, Bao 'an District, Shenzhen
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