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MicroASM M micro assembly bonding machine
Classification:
- DESCRIPTION
- key Parameter
- Application Area
- Related Processes
- Product Advantages
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M platform is an off-line semi-automatic micro-assembly system. Based on this platform, three models of M5/M10/M20 with different positioning accuracy were developed. Equipped with nozzle heating module, laser heating module, UV dispensing and curing module, hot nitrogen protection gas module, base preheating module, process monitoring module, chip flip welding module.
With the laser welding module, it can complete mini LED flexible circuit board repair, large medical equipment (core imaging module assembly), optical devices (Laser LD Pd bar assembly, VCSEL, PD, LENS assembly, etc.), semiconductor (MEMS devices, Rf devices, microwave devices and hybrid circuits).
This series of products have stable performance, high cost performance and convenient operation, especially suitable for scientific research institutes and academic laboratories that require low production efficiency and high precision.
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Working mode off-line semi-automatic
Z axis travel 150mm
400*800mm Operating range 400*800mm
T-axis travel 360°
0.05-40mm The device size range is 0.05-40mm
XY axis resolution 2μ
Comprehensive mounting accuracy ±1μ 3σ
Z axis resolution 2μ
XY drive linear motor
T axis resolution 0.01°
The bonding force controls 20-1000g
The upper visual system resolution is 1.4μ
The process monitoring system can record and take pictures
Lower visual system resolution 1.4μ
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MEMS encapsulation
Flip chip bonding
Formal chip bonding
Laser diode laser bar welding
Optical module package
Sensor package
The Mini LED mount
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Laser heating
Adhesive technology
Curing (uv, temperature)
Eutectic welding gold tin and indium
Laser bar packaging
Hot pressing
Wafer level high precision adhesive
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Off-line semi-automatic operation, easy to operate and cost-effective
High repeatability and application flexibility
Customized function modules and development process according to customer needs
Real-time observation and feedback greatly reduce process development time
Rapid realization of the research and development process to the production process to ensure reliable results
Man-machine friendly interface is easy to operate and easy to program
Control all process related parameters: pressure, temperature, time, power, light source and image, process environment, etc
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Company Website:http://www.microasm.com
Company Email:sales@microasm.com
Office Headquarters: 13th Floor, Building 4, Xingyuan Advanced Materials Industrial Park, Shutianpu Community, Matian Street, Guangming District, ShenzhenOffice: Yangyong Industrial Zone, Shapu Community, Songgang Street, Bao 'an District, Shenzhen
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