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MicroASM AMX full-function Die-Bonder
Classification:
- DESCRIPTION
- key Parameter
- Application Area
- Related Processes
- Product Advantages
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MicroASM AMX full-function Die-Bonder
AM-X platform is a complete micro assembly system. Its core module integrates three parts: high-precision mount system, prefix system and production data analysis. The double drive structure of micron gantry can be conveniently composed and generated online.
It can be equipped with nozzle heating module, material plate/wafer placing plate, ultrasonic module, laser heating module, UV dispensing and curing module, hot nitrogen and formic acid process protection gas module, base preheating module, process monitoring module, chip flip welding module.
It is widely used in electronic equipment (Micro LED, mini LED display chip, metric 03015, 008004 on the next generation mobile phone), medical equipment (CT imaging module assembly), optical devices (Laser LD PD bar assembly, VCSEL, PD, LENS assembly, etc.), semiconductor (MEMS devices, Rf devices, microwave devices and hybrid circuits) and other fields.
The AM-X system will record the mount data of each product in real time, so that the production status can be inquired freely and flexibly, and the mount compensation data can be adjusted according to the dynamic data to achieve the best production status.
Product Video
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type
AM-5X
AM-10X
Lighting system
RGB panchromatic ring light source
Mounting accuracy
±2.5μm 3sigma
±5μm 3sigma
Process monitoring system (optional)
Can be record
Wy of work
Online full-automatic
Online full-automatic
Gripper pickup tool head
customized
Operating range
400*800mm
400*800mm
MagazineTransfer System(optional)
customized
Mount device size range
0.03-100mm
0.03-100mm
Cassette (optional)
25 pieces of the standard
Comprehensive mounting accuracy
±2.5μm 3sigma
±5μm 3sigma
Wafer table(optional)
Compatible with 8 inches, 6 inches and 4 inches
XY driven form
Linear motor
Linear motor
WaferTransfer System(optional)
standard
travel
X:400mm Y:900mm
X:400mm Y:900mm
Fixed feeding method
Gel - pack, Tray, Waferpack, feeder, etc., support customization
Z:80mm T:360°
Z:80mm T:360°
Process protection gas (optional)
Hot nitrogen/formic acid
XY axis resolution
0.5μ
1μ
Dispensing system (optional)
Musashi dispensing system is compatible with UV dispensing, epoxy dispensing and silver dispensing
Z axis resolution
0.5μ
1μ
Curing system (optional)
UV curing/heat curing
T axis resolution
0.003°
0.005°
Eutectic welding system with friction function (optional)）
X/Y/45° friction welding 25~500 ° c
Bonding force control
20-500g
20-500g
Laser hot pressing bonding system (optional)
MicroASM 25-1000℃
upper visual system
1μ
2μ
Access requirements
220 V 10A 0.5 mpa compressed air
Lower visual system
1μ
2μ
Dimensions and weight
1050X1550X1850mm(not including monitor)1800kg
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Micro LED, mini LED array chip mounting
Microchip, display chip package
Metric 03015, 008004 on next generation mobile phones
Medical equipment (CT imaging module assembly)
Optical devices (Laser LD PD bar assembly, VCSEL, PD, LENS, etc.)
Semiconductor (MEMS devices, Rf devices, microwave devices and hybrid circuits)
Silicon chips, GaAs chips, AlGaInN, etc
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Laser heating
Adhesive technology
Curing (UV, heating)
Reflow welding \ eutectic, tin gold, indium
Mems assembly
Hot pressing
Ultrasonic welding heat
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Online full-automatic operation, high production efficiency
Integration of high precision mount system, prefix system and production data analysis system
Record the mounting data of each product and inquire the production status in real time
Man-machine friendly interface is easy to operate and easy to program
Machine intelligence controls all process related parameters: pressure, temperature, time, power, light source and image, and process environment
According to the needs of the free collocation of relevant functional modules: laser heating module, suction nozzle heating module, UV dispensing and curing module
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Contact Us
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Company Website:http://www.microasm.com
Company Email:sales@microasm.com
Office Headquarters: 13th Floor, Building 4, Xingyuan Advanced Materials Industrial Park, Shutianpu Community, Matian Street, Guangming District, ShenzhenOffice: Yangyong Industrial Zone, Shapu Community, Songgang Street, Bao 'an District, Shenzhen
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