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MicroASM AMS invert bonding machine
Classification:
- DESCRIPTION
- key Parameter
- Application Area
- Related Processes
- Product Advantages
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AM-S platform is an off-line automatic micro assembly system developed by the company, which can be equipped with nozzle heating module, material tray/wafer placing plate, ultrasonic module, laser heating module, UV dispensing and curing module, hot nitrogen and formic acid process protection gas module, base preheating module, process monitoring module, chip flip welding module.
The platform features a marble bridge structure and core motion-related components from the Israeli military brand ELMO drive system and TECNOTION, a top line Dutch linear drive motor which achieves a 0.1 μ resolution and 0.5 μ single-axis repeat positioning accuracy.
Company's software system integrates equipment internal temperature control, mount precision self-tuning, mount data analysis and other functional modules. We can customize the process, software and module for different customer requirements, and combine the application of equipment with the actual process depth of customers.
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type
AM-5S
AM-10S
Lighting system
RGB panchromatic ring light source
Mounting accuracay
±2.5μm 3sigma
±5μm 3sigma
Process monitoring system (optional)
Can be record
Way of work
Off-line automatic
Off-line automatic
Gripper pickup tool head
customized
Operating range
200*300mm
200*300mm
Suction nozzle
customized
Mount device size range
0.03-40mm
0.03-40mm
Fixed feeding method
Gel-pack,Tray,Waferpack etc,
Comprehensive mounting accuracy
±2.5μm 3sigma
±5μm 3sigma
Eutectic module (optional)
30℃～500
XY driven form
Linear motor
Linear motor
Process protection gas (optional)
Hot nitrogen
Displacement
distance
X:300mm Y:350mm
X:300mm Y:350mm
Dispensing system (optional)
Musashi dispensing system is compatible with UV dispensing, epoxy dispensing and silver dispensing
Z:150mm T:360°
Z:150mm T:360°
Curing system (optional)
Uv curing/heat curing
XY resolution
0.5μ
1μ
Height measurement (optional)
0.005mm Keenshi laser measures 0.005 mm
Z resolution
0.5μ
1μ
Laser hot pressing bonding system (optional)
MicroASM 25-1000℃
T resolution
0.003°
0.005°
Ultrasonic hot pressing bonding system (optional)
MicroASM 25~450℃
Bonding force control
20-500g
20-500g
Access requirements
220 power 10a0.5 mpa compressed air
Upper visual system
1μ
2μ
Dimensions and weight
1050X1550X1850mm(not including monitor)1800kg
Lower visual system
1μ
2μ
weight
1000kg
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MEMS encapsulation
Flip chip bonding
Formal chip bonding
Wafer level package
Optical module package
Sensor package
Mini LED mounting
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Laser heating
Adhesive technology
Curing (uv, temperature)
Eutectic welding gold tin and indium
Mems assembly
Hot pressing
Wafer level high precision adhesive
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Function modules can be customized according to different customer needs
Can be customized according to different customer requirements process
Wafer level high precision chip mount
The machine can be assembled automatically without the influence of human factors
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Company Website:http://www.microasm.com
Company Email:sales@microasm.com
Office Headquarters: 13th Floor, Building 4, Xingyuan Advanced Materials Industrial Park, Shutianpu Community, Matian Street, Guangming District, ShenzhenOffice: Yangyong Industrial Zone, Shapu Community, Songgang Street, Bao 'an District, Shenzhen
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