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MicroASM AMS invert bonding machine
AM-S platform is an off-line automatic micro assembly system developed by the company, which can be equipped with nozzle heating module, material tray/wafer placing plate, ultrasonic module, laser heating module, UV dispensing and curing module, hot nitrogen and formic acid process protection gas module, base preheating module, process monitoring module, chip flip welding module.
MicroASM AMS invert bonding machine
AM-S platform is an off-line automatic micro assembly system developed by the company, which can be equipped with nozzle heating module, material tray/wafer placing plate, ultrasonic module, laser heating module, UV dispensing and curing module, hot nitrogen and formic acid process protection gas module, base preheating module, process monitoring module, chip flip welding module.
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Company Website:http://www.microasm.com
Company Email:sales@microasm.com
Office Headquarters: 13th Floor, Building 4, Xingyuan Advanced Materials Industrial Park, Shutianpu Community, Matian Street, Guangming District, ShenzhenOffice: Yangyong Industrial Zone, Shapu Community, Songgang Street, Bao 'an District, Shenzhen
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