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ShuttleStar RW - SV560A
Classification:
- DESCRIPTION
- key Parameter
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ShuttleStar RW-SV560A
SV560A adopts streamlined appearance design, saving space, with automatic material absorption, automatic welding, automatic disassembly, automatic material discharge. It equipped with up and down hot air, bottom infrared, three temperature zone independent heating, heating time and temperature real-time display. The bottom of the machine is equipped with the strong cross-flow fan cooling, which can cool quickly and reliably; It has the functions of light splitting, amplification and fine adjustment, including color difference distinguishing device, automatic focus and software operation. It equipped embedded industrial control computer, touch screen man-machine interface, and it can be compared with the historical preservation curve; It has vacuum pump built inside, 8-stage temperature control, and process parameters can be mass storage. The pressure can be controlled in a small range. Alloy hot air nozzle of various sizes, easy to replace, can be positioned at any Angle of 360°.
Product Video
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PCB size W20*D20 ~ W540*D450 mm
Processing range W540*450 mm
PCB thickness 0.5 ~ 4mm
Suitable chip 1*1 ~ 80*80mm
Mounting accuracy ±0.05mm
Minimum spacing 0.15mm
Degree of automation Intelligent full-automatic
Visual alignment system High definition
Heating zone three temperature zones
Temperature curve upper and lower eight temperature zones
Temperature measurement channel Five
Interface The man-machine interface is displayed both in English and Chinese
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Industrial computer, set-top box, vehicle-mounted electronic, UAVs(unmanned aerial vehicles), mobile phone motherboard and high-difficulty repair components, it can repair special and high-difficulty repair components, including CGA, BGA, QFN, CSP, LGA, Micro SMD, MLF(Micro Lead Frames)
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Automatic removal of faulty devices
Clean pad and add solder (flux or tin paste)
Automatic suction, automatic alignment, automatic mounting
Selective temperature curve
Automatic welding, automatic cooling
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It adopts the integration design of hot air head and mount head, which can achieve automatic material absorption, automatic welding, automatic placement.
It equipped with up and down hot air, infrared at the bottom, three temperature zone independent heating, heating time and temperature real-time display, color optical visual system, with the function of spectral, amplification and fine-tuning, using HDMI HD display, millions of pixels high-definition cameras, high power optical zoom; It equipped embedded industrial control computer, PLC control, real-time temperature curve display, and temperature curve analysis can be compared with the historical preservation curve. Suction nozzle pressure can be adjusted, the minimum pressure is less than 30g, to ensure that BGA does not overflow tin when welding. Built-in vacuum pump, the maximum vacuum suction is up to 80G. Fine tuning suction nozzle, which can achieve 0-60° rotation. 8-segment temperature rise (fall) + 8-segment constant temperature control, mass storage of temperature curve, curve analysis can be carried out on the touch screen.
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Company Website:http://www.microasm.com
Company Email:sales@microasm.com
Office Headquarters: 13th Floor, Building 4, Xingyuan Advanced Materials Industrial Park, Shutianpu Community, Matian Street, Guangming District, ShenzhenOffice: Yangyong Industrial Zone, Shapu Community, Songgang Street, Bao 'an District, Shenzhen
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